Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
7.1
3.5
Journals
Micromachines
Special Issues
Micro/Nano Manufacturing of Electronic Devices, 2nd Edition
share announcement

Micro/Nano Manufacturing of Electronic Devices, 2nd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 20 November 2026 | Viewed by 1054

Editors

Prof. Dr. Guo Liu

E-Mail Website
Guest Editor
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: vacuum electronic devices; passive pulse compressor; microwave biosensor; dielectric microwave measurement
Special Issues, Collections and Topics in MDPI journals
Dr. Haoyue Li

E-Mail Website
Guest Editor
Zhengzhou Research Institute, Harbin Institute of Technology, Zhengzhou 450000, China
Interests: dissimilar material welding; laser micro-welding; laser beam control; interfacial reaction; mechanical properties
Special Issues, Collections and Topics in MDPI journals
Dr. Qianqian Chen

E-Mail Website
Guest Editor
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: sealing of microwave devices; brazing; interfacial behavior regulation; microstructure

Special Issue Information

Dear Colleagues,

As the demand for more sophisticated and miniaturized electronic devices accelerates, micro/nano-manufacturing technologies play a pivotal role in shaping the future of electronic components. This Special Issue aims to highlight the latest advancements in micro/nano-scale processes, containing micro-joining, laser micromachining, etc., and their applications in electronic devices. These technologies are integral to modern electronic manufacturing, driving innovations that enhance device performance, reliability, and integration.

We invite researchers and engineers to contribute original research articles and comprehensive reviews that explore the following areas, among others: advancements in soldering techniques and materials, laser micromachining technologies, and the development of micro/nanostructures for surface and interface engineering. Contributions that address modeling, simulation, reliability assessments, and manufacturing tools in these domains are also highly encouraged.

This Special Issue seeks to provide a platform for sharing breakthroughs and fostering collaboration in the intersection of micro/nano-manufacturing of electronic device fabrication, advancing both fundamental understanding and practical applications in this rapidly evolving field.

Prof. Dr. Guo Liu
Dr. Haoyue Li
Dr. Qianqian Chen
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micromachining of vacuum electronic devices
  • interface engineering of sensors
  • microelectronics assembly
  • micro/nano-scale processes
  • micro-joining
  • laser micromachining
  • emerging microfabrication technologies
  • micro/nanostructures for surface and interface engineering
  • reliability assessment

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Related Special Issue

Published Papers (1 paper)

Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

17 pages, 8735 KB  
Article
Regulation of Laser-Deposited Silver Microstructures on Ceramic Surfaces and Their Effects on Electrical Conductivity
by Hui Zhang, Yongling Wu and Hongyu Zheng
Micromachines 2026, 17(6), 702; https://doi.org/10.3390/mi17060702 - 8 Jun 2026
Viewed by 565
Abstract
Silver conductive structures were fabricated on 96% alumina ceramic substrates by selectively irradiating a silver nitrate precursor liquid film using a 355 nm Nd:YAG nanosecond laser under ambient conditions, without the use of external reducing agents. The effects of laser energy density, scan [...] Read more.
Silver conductive structures were fabricated on 96% alumina ceramic substrates by selectively irradiating a silver nitrate precursor liquid film using a 355 nm Nd:YAG nanosecond laser under ambient conditions, without the use of external reducing agents. The effects of laser energy density, scan number, precursor concentration, plasma pretreatment, and PVP-30 addition on the morphology, composition, electrical conductivity, and adhesion of the deposited structures were investigated using XRD, SEM, EDS, contact angle measurements, resistance measurements, and tape-peeling tests. XRD confirmed the formation of metallic Ag in the laser-scanned regions. Insufficient laser energy density led to incomplete Ag+ reduction and discontinuous conductive paths, whereas excessive energy input caused hollow formation and Ag edge accumulation. A laser energy density of 12.03 J/cm2 provided a favorable balance among structural integrity, Ag enrichment, and electrical conductivity. Increasing the scan number promoted particle coalescence and conductive network formation, while 1000 scanning cycles provided a suitable balance between structural continuity and dimensional precision. As the AgNO3 concentration increased, the deposited structures evolved from isolated particles into continuous and compact layers, with 5 mol/L showing favorable deposition performance. Plasma pretreatment combined with PVP-30 addition reduced the contact angle of the ceramic surface from 48.25° to 19.05°, thereby improving the continuity, uniformity, and compactness of the deposits. After the scan spacing was reduced to form continuous silver films, the samples retained more than 98% of their conductivity after five tape-peeling cycles, with a resistivity of 6.14 × 10−8 Ω·m. These results demonstrate that laser-induced deposition is a controllable strategy for fabricating conductive silver structures on ceramic surfaces. Full article
(This article belongs to the Special Issue Micro/Nano Manufacturing of Electronic Devices, 2nd Edition)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-1
Back to TopTop