Special Issue "SiC-Based Microsystems"
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (15 March 2017).
Interests: microsystems; piezoresistive sensor; sensor for harsh environments; SOI and SiC-based sensor; accelerometers; gas sensor; design and simulation of microsystems; graphene; material research; graphene-based sensors; biosensors; printed sensors; 2D sensors; technologies
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Microsystems technology continues to grow rapidly. Silicon is currently the dominant platform for Microsystems technology. The material possesses both favorable electrical and mechanical properties to create micro devices and systems. Silicon-based Microsystems leverage the batch fabrication paradigm and benefit from a large body of knowledge regarding masking, deposition, growth, modification, and structuring techniques. But silicon does have some limitations. Silicon softens dramatically and dopants diffuse at high temperature. Standard silicon based devices can no longer be used at temperatures higher 150 °C. In order to develop a new generation of devices, which can survive and operate properly in such harsh environments, well beyond regimes of silicon-based devices, new materials and technologies are necessary.
The compound semiconductor silicon carbide (SiC) possesses a number of properties, e.g., large bandgap, high electron drift velocity, high electric breakdown field, high chemical resistance, radiation hardness, and mechanical strength, which makes it an attractive base material for the fabrication of a series of electronic and micromechanical devices, such as high temperature, high power, high frequency, microwave, optoelectronic, and sensor devices, as well as for applications in chemically- and radiation-harsh environments. Progress in SiC growth and deposition has been made within the last few years, and the significance of SiC as a substrate material has continuously increased. Some prototype and commercial devices using the hexagonal 4H and 6H polytypes have been fabricated
The purpose of this Micromachines Special Issue, on SiC-Based Microsystems, is to get an overview of these activities on developments of new deposition and growth methods, fabrication technologies, new devices and systems, such as sensors and actuators, electronic circuits, wireless modules, and also testing and characterization of such systems.
Prof. Dr. Ha Duong Ngo
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Silicon Carbide
- SiC MEMS
- SiC based Microsystems
- SiC MEMS, Ceramics
- MEMS for Harsh Environments