Next Article in Journal
Performance of Quad Mass Gyroscope in the Angular Rate Mode
Next Article in Special Issue
Color-Tunable White LEDs with Single Chip Realized through Phosphor Pattern and Thermal-Modulating Optical Film
Previous Article in Journal
Raman Mapping of Biological Systems Interacting with a Disordered Nanostructured Surface: A Simple and Powerful Approach to the Label-Free Analysis of Single DNA Bases
Article

Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

by 1,2,†, 1,2,†, 3,*, 4, 1,2, 1,2 and 1,2,*
1
Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China
2
SCNU-TUE Joint Lab of Device Integrated Responsive Materials (DIRM), National Center for International Research on Green Optoelectronics, South China Normal University, No 378, West Waihuan Road, Guan zhou Higher Education Mega Center, Guangzhou 510006, China
3
Department of Mechanical Engineering, Guangdong Technical College of Water Resources and Electric Engineering, Guangzhou 510925, China
4
Kone Elevators (China) Co. Ltd., Kunshan 215347, China
*
Authors to whom correspondence should be addressed.
These authors contributed equally to this work and should be considered co-first authors.
Academic Editor: Bassem Salem
Micromachines 2021, 12(3), 265; https://doi.org/10.3390/mi12030265
Received: 28 January 2021 / Revised: 26 February 2021 / Accepted: 2 March 2021 / Published: 4 March 2021
(This article belongs to the Special Issue Microsystem for Electronic Devices)
Heat sinks are widely used in electronic devices with high heat flux. The design and build of microstructures on heat sinks has shown effectiveness in improving heat dissipation efficiency. In this paper, four kinds of treatment methods were used to make different microstructures on heat sink surfaces, and thermal radiation coating also applied onto the heat sink surfaces to improve thermal radiation. The surface roughness, thermal emissivity and heat dissipation performance with and without thermal radiation coating of the heat sinks were studied. The result shows that with an increase of surface roughness, the thermal emissivity can increase up to 2.5 times. With thermal radiation coating on a surface with microstructures, the heat dissipation was further improved because the heat conduction at the coating and heat sink interface was enhanced. Therefore, surface treatment can improve the heat dissipation performance of the heat sink significantly by enhancing the thermal convection, radiation and conduction. View Full-Text
Keywords: heat sinks; surface microstructures; heat dissipation performance; thermal radiation; surface roughness heat sinks; surface microstructures; heat dissipation performance; thermal radiation; surface roughness
Show Figures

Figure 1

MDPI and ACS Style

You, Y.; Zhang, B.; Tao, S.; Liang, Z.; Tang, B.; Zhou, R.; Yuan, D. Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices. Micromachines 2021, 12, 265. https://doi.org/10.3390/mi12030265

AMA Style

You Y, Zhang B, Tao S, Liang Z, Tang B, Zhou R, Yuan D. Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices. Micromachines. 2021; 12(3):265. https://doi.org/10.3390/mi12030265

Chicago/Turabian Style

You, Yuxin, Beibei Zhang, Sulian Tao, Zihui Liang, Biao Tang, Rui Zhou, and Dong Yuan. 2021. "Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices" Micromachines 12, no. 3: 265. https://doi.org/10.3390/mi12030265

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop