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Micromachines
Special Issues
Advances in Infrared and Physical Sensors
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Advances in Infrared and Physical Sensors

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: closed (31 July 2022) | Viewed by 6507

Special Issue Editors

Dr. Jingxuan Wei

E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
Interests: Infrared detectors; optical sensors; metasurfaces and metamaterials; plasmonics; micromanufacturing; MEMS; two-dimensional materials
Dr. Xianhao Le

E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
Interests: piezoelectric MEMS resonators; gas sensors; inertial sensors; two-dimensional materials; piezoelectric micromachined ultrasonic transducers

Special Issue Information

Dear Colleagues,

Along with the emerging Internet of Things and distributed sensors network, we have seen an enormous demand for sensors with a smaller footprint, lower power consumption, and higher sensitivity. Among these, infrared sensors detect electromagnetic waves with wavelength above 760 nm, which are widely used in night vision, communications, remote temperature monitoring, chemical analysis, etc. In practice, infrared radiation is usually transduced into other physical quantities, such as temperature, conductance, and pressure. In the meantime, physical sensors, detecting these quantities and others in the environment, provide complementary information to infrared sensors. More excitingly, because of the internal similarities between infrared and physical sensors, we have witnessed in the past few years many exciting works on infrared sensors adapted from physical sensors. This Special Issue seeks to showcase research papers and review articles that focus on (1) novel infrared sensors, (2) novel physical sensors, and (3) their applications for environmental monitoring, thermal imaging, biosensing, and so on.

Dr. Jingxuan Wei
Dr. Xianhao Le
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • infrared sensors
  • infrared photodetectors
  • physical sensors
  • pressure sensors
  • temperature sensors
  • gas sensors
  • acoustic sensors
  • environmental monitoring

Published Papers (3 papers)

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Research

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16 pages, 4340 KiB  
Article
Germanium-Tin (GeSn) Metal-Semiconductor-Metal (MSM) Near-Infrared Photodetectors
by Ricky Wenkuei Chuang, Yu-Hsin Huang and Tsung-Han Tsai
Micromachines 2022, 13(10), 1733; https://doi.org/10.3390/mi13101733 - 14 Oct 2022
Cited by 2 | Viewed by 1564
Abstract
Narrow-bandgap germanium–tin (GeSn) is employed to fabricate metal–semiconductor–metal (MSM) near-infrared photodetectors with low-dark currents and high responsivity. To reduce the dark current, the SiO2 layer is inserted in between the metal and semiconductor to increase the barrier height, albeit at the expense [...] Read more.
Narrow-bandgap germanium–tin (GeSn) is employed to fabricate metal–semiconductor–metal (MSM) near-infrared photodetectors with low-dark currents and high responsivity. To reduce the dark current, the SiO2 layer is inserted in between the metal and semiconductor to increase the barrier height, albeit at the expense of photocurrent reduction. To couple more incident light into the absorption layer to enhance the responsivity, the distributed Bragg reflectors (DBRs) are deposited at the bottom of the GeSn substrate while placing the anti-reflection layer on the surface of the absorption layer. With the interdigital electrode spacing and width, both set at 5 µm and with 1 V bias applied, it is found the responsivities of the generic MSM control sample detector, the MSM with DBR, and the MSM with AR layer are 0.644 A/W, 0.716 A/W, and 1.30 A/W, respectively. The corresponding specific detectivities are 8.77 × 1010, 1.11 × 1011, and 1.77 × 1011 cm·Hz1/2/W, respectively. The measurement data show that these designs effectively enhance the photocurrent and responsivity. At 1 V bias voltage, normalized responsivity evinces that the photodetection range has been extended from 1550 nm to over 2000 nm, covering the entire telecommunication band. Incorporating GeSn as a sensing layer offers one of the new alternative avenues for IR photodetection. Full article
(This article belongs to the Special Issue Advances in Infrared and Physical Sensors)
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18 pages, 5914 KiB  
Article
Deformation Monitoring and Shape Reconstruction of Flexible Planer Structures Based on FBG
by Huifeng Wu, Rui Dong, Zheng Liu, Hui Wang and Lei Liang
Micromachines 2022, 13(8), 1237; https://doi.org/10.3390/mi13081237 - 31 Jul 2022
Cited by 6 | Viewed by 1673
Abstract
To reduce the dependence of real-time deformation monitoring and shape reconstruction of flexible planar structures on experience, mathematical models, specific structural curvature (shape) sensors, etc., we propose a reconstruction approach based on FBG and a data-driven model; with the aid of ANSYS finite [...] Read more.
To reduce the dependence of real-time deformation monitoring and shape reconstruction of flexible planar structures on experience, mathematical models, specific structural curvature (shape) sensors, etc., we propose a reconstruction approach based on FBG and a data-driven model; with the aid of ANSYS finite element software, a simulation model was built, and training samples were collected. After the machine learning training, the mapping relationship was established, which is between the strain and the deformation variables (in three directions of the x-, y-, z-axis) of each point of the surface of the flexible planar structure. Four data-driven models were constructed (linear regression, regression tree, integrated tree, and BP neural network) and comprehensively evaluated; the predictive value of the BP neural network was closer to the true value (R2 = 0.9091/0.9979/0.9964). Finally, the replication experiment on the flexible planar structure specimen showed that the maximum predictive error in the x-, y-, and z-axis coordinates were 2.93%, 35.59%, and 16.21%, respectively. The predictive results are highly consistent with the expected results of flexible planar structure deformation monitoring and shape reconstruction in the existing test environment. The method provides a new high-precision method for the real-time monitoring and shape reconstruction of flexible planar structures. Full article
(This article belongs to the Special Issue Advances in Infrared and Physical Sensors)
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Review

Jump to: Research

20 pages, 3843 KiB  
Review
A Review of Fault Diagnosis Methods for Rotating Machinery Using Infrared Thermography
by Rongcai Wang, Xianbiao Zhan, Huajun Bai, Enzhi Dong, Zhonghua Cheng and Xisheng Jia
Micromachines 2022, 13(10), 1644; https://doi.org/10.3390/mi13101644 - 30 Sep 2022
Cited by 7 | Viewed by 2565
Abstract
At present, rotating machinery is widely used in all walks of life and has become the key equipment in many production processes. It is of great significance to strengthen the condition monitoring of rotating machinery, timely diagnose and eliminate faults to ensure the [...] Read more.
At present, rotating machinery is widely used in all walks of life and has become the key equipment in many production processes. It is of great significance to strengthen the condition monitoring of rotating machinery, timely diagnose and eliminate faults to ensure the safe and efficient operation of rotating machinery and improve the economic benefits of enterprises. When the state of a rotating machine deteriorates, the thermal energy that is much more than its normal operation will be generated due to the increase in the friction between the components or other factors. Therefore, using the infrared thermal camera to collect the infrared thermal images of rotating machinery and judge the health status of rotating machinery by observing the temperature distribution in the thermal images is often more rapid and effective than other technologies. Nevertheless, after decades of development, the research achievements of infrared thermography (IRT) and its application in various industrial fields are numerous and complex, and there is a lack of systematic sorting and summary of the achievements in this field. Accordingly, this paper summarizes the development and application of IRT as a non-contact and non-invasive tool for equipment condition monitoring and fault diagnosis, and introduces the basic theory of IRT, image processing technology and fault diagnosis methods of rotating machinery in detail. Finally, the review is summarized and some future potential topics are proposed, which will make the subject easier for beginners and non-experts to understand. Full article
(This article belongs to the Special Issue Advances in Infrared and Physical Sensors)
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