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Micromachines
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Laser Micro/Nano-Fabrication, 2nd Edition
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Laser Micro/Nano-Fabrication, 2nd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 31 July 2026 | Viewed by 840

Special Issue Editors

Dr. Yixuan Feng

E-Mail Website
Guest Editor
Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
Interests: ultrasonic-vibration-assisted milling; laser-assisted milling
Special Issues, Collections and Topics in MDPI journals
Dr. Man Zhao

E-Mail Website
Guest Editor
School of Mechanical and Automotive Engineering, Shanghai University of Engineering and Science, Shanghai 201620, China
Interests: advanced manufacturing; microstructure evolution; residual stress
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Laser micro/nano-fabrication has a wide range of applications in subtractive machining, such as precision cutting and engraving related to laser ablation and melting; additive machining, such as laser-induced chemical deposition and micro-cladding related mainly to laser-melted and -induced chemical reactions; and laser welding and forming based on the heating effect. In this Special Issue, we will study the interaction of a laser with materials during micro/nano-fabrication for better control and its application in different systems and processes. This Special Issue’s scope includes, but is not limited to, the following: the heat-affected zone during laser processing; microstructure change under laser and machining effects; process control of the laser for better material removal rate, tool life, surface finish, and/or residual stress; and the scale effect during laser micro/nano-fabrication.

We look forward to receiving your valuable contributions.

Dr. Yixuan Feng
Dr. Man Zhao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • laser subtractive machining
  • laser additive machining
  • heat-affected zone
  • microstructure
  • tool life
  • surface finish
  • residual stress

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Related Special Issue

Published Papers (1 paper)

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Research

16 pages, 10259 KB  
Article
Study on the Mechanism of Chemical–Mechanical Synergistic Removal of SiC Surfaces Based on Electrochemical Friction Wear of Grinding Wheel Pairs
by Lijie Wu, Zhijun Chen, Yangting Ou, Jiawen Yao, Hang Zhang, Qiusheng Yan and Jisheng Pan
Micromachines 2026, 17(3), 307; https://doi.org/10.3390/mi17030307 - 28 Feb 2026
Viewed by 670
Abstract
With the advancement of SiC wafers toward 12 inches and innovations in laser cutting technology, new demands have emerged for SiC grinding techniques—namely, high efficiency, low loss, and low wear ratio. This paper investigates electrochemical-assisted grinding of SiC using a grinding wheel–SiC pair [...] Read more.
With the advancement of SiC wafers toward 12 inches and innovations in laser cutting technology, new demands have emerged for SiC grinding techniques—namely, high efficiency, low loss, and low wear ratio. This paper investigates electrochemical-assisted grinding of SiC using a grinding wheel–SiC pair model system, examining the effects of electrolyte type, concentration, voltage, load, and rotational speed on wear behavior. Experimental results reveal that NaCl is the most effective electrolyte among the six candidates tested. In the NaCl system, wear behavior is strongly influenced by the interplay between voltage and rotational speed. At a constant voltage of 3 V, increasing the rotational speed to 600 rpm produces a wear area of 1911.93 μm2, while at a higher voltage of 7 V with a lower speed of 200 rpm, the wear area reaches 1301.96 μm2, indicating that optimal material removal requires synergistic matching of electrical and mechanical parameters. At 2 wt% NaCl, a sudden change in wear behavior occurs at 6–7 min, indicating a dynamic balance between oxide formation and mechanical removal. Rotational speed shows a turning point at 600 rpm, where the wear mechanism shifts significantly, marking the transition to a synergistically enhanced regime. EDS analysis confirms that Na2SO4 increases surface oxygen content by 54.4% compared to deionized water, demonstrating enhanced electrochemical oxidation. The optimal parameter window for synergistic removal is identified as 1–2 wt% NaCl, 5–7 V, 600 rpm, and 100–150 g. This study provides quantitative insights into the synergistic removal mechanism of SiC, offering a theoretical foundation for developing efficient, low-loss electrochemical grinding technologies. Full article
(This article belongs to the Special Issue Laser Micro/Nano-Fabrication, 2nd Edition)
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