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Micromachines
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Laser Micro/Nano-Fabrication
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Laser Micro/Nano-Fabrication

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 3003

Special Issue Editors

Dr. Yixuan Feng

E-Mail Website
Guest Editor
Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
Interests: ultrasonic-vibration-assisted milling; laser-assisted milling
Special Issues, Collections and Topics in MDPI journals
Dr. Man Zhao

E-Mail Website
Guest Editor Assistant
School of Mechanical and Automotive Engineering, Shanghai University of Engineering and Science, Shanghai 201620, China
Interests: advanced manufacturing; microstructure evolution; residual stress
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Laser micro/nano-fabrication has a wide range of applications in subtractive machining, such as precision cutting and engraving related to laser ablation and melting; additive machining, such as laser-induced chemical deposition and micro-cladding related mainly to laser-melted and -induced chemical reactions; and laser welding and forming based on the heating effect. In this Special Issue, we will study the interaction of a laser with materials during micro/nano-fabrication for better control and its application in different systems and processes. This Special Issue’s scope includes but is not limited to the following: the heat-affected zone during laser processing; microstructure change under laser and machining effects; process control of the laser for better material removal rate, tool life, surface finish, and/or residual stress; and the scale effect during laser micro/nano-fabrication.

We look forward to receiving your submissions!

Dr. Yixuan Feng
Guest Editor

Dr. Man Zhao
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • laser subtractive machining
  • laser additive machining
  • heat-affected zone
  • microstructure
  • tool life
  • surface finish
  • residual stress

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Published Papers (4 papers)

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Research

18 pages, 3961 KiB  
Article
Fabrication and Performance of Aluminum-Based Composite Wicks Using a Two-Step Laser-Sintering Process
by Yong Tang, Yuxin Wei, Tong Sun, Jingjing Bai, Fangqiong Luo, Huarong Qiu, Yiming Li, Wei Yuan and Shiwei Zhang
Micromachines 2025, 16(4), 370; https://doi.org/10.3390/mi16040370 - 25 Mar 2025
Viewed by 228
Abstract
The evolution of 5G technology necessitates effective thermal management strategies for compact, high-power devices. The potential of aluminum-based vapor chambers (VCs) as thermal management solutions is recognized, yet the heat transfer performance is limited by the capillary constraints of the wick structures. This [...] Read more.
The evolution of 5G technology necessitates effective thermal management strategies for compact, high-power devices. The potential of aluminum-based vapor chambers (VCs) as thermal management solutions is recognized, yet the heat transfer performance is limited by the capillary constraints of the wick structures. This study proposes a laser-sintered composite wick to address this limitation. Experimental evaluations were conducted on microgroove wicks (MW) and groove–spiral woven mesh composite wicks (GSCW), utilizing ethanol and acetone as the working fluids. The MW, characterized by a laser spacing of 0.2 mm and two passes, demonstrated a capillary rise of 52.90 mm, while the spiral woven mesh (SWM) achieved a rise of 61.48 mm. Notably, the GSCW surpassed both configurations, reaching a capillary height of 84.57 mm and a capillary parameter (K/Reff) of 2.769 μm, which corresponds to increases of 90.15% and 43.76% over the MW and SWM, respectively. This study demonstrates an effective approach to enhancing the capillary performance of aluminum wicks, which provides valuable insights for the design of composite wicks, particularly for applications in ultra-thin aluminum VC. Full article
(This article belongs to the Special Issue Laser Micro/Nano-Fabrication)
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20 pages, 18781 KiB  
Article
Demonstration of Pattern Size Effects on Hydrophobic Nanocellulose Coatings with Regular Micron-Sized Island-like Geometrical Domains Created by Femtosecond Laser Micromachining
by Pieter Samyn, Patrick Cosemans and Olivier Malek
Micromachines 2025, 16(3), 289; https://doi.org/10.3390/mi16030289 - 28 Feb 2025
Viewed by 444
Abstract
As inspired by nature, wettability of bio-based material surfaces can be controlled by combining appropriate surface chemistries and topographies mimicking the structure of plant leaves or animals. The need for bio-based nanocellulose coatings with enhanced hydrophobic properties becomes technically relevant for extending their [...] Read more.
As inspired by nature, wettability of bio-based material surfaces can be controlled by combining appropriate surface chemistries and topographies mimicking the structure of plant leaves or animals. The need for bio-based nanocellulose coatings with enhanced hydrophobic properties becomes technically relevant for extending their applications in the technological domain with better protection and lifetime of the coatings. In this work, the water repellence of spray-coated nanocellulose coatings with hydrophobically modified cellulose microfiber (mCMF coatings), or hydrophobically modified cellulose nanofiber (mCNF coatings) was enhanced after femtosecond laser patterning. In particular, the influences of different island-like pattern geometries and pattern sizes were systematically studied. The island-like patterns were experimentally created with single posts that have variable sizes of the valleys (B = 30 to 15 µm) and top surface area (T = 120 to 15 µm), resulting in good resolution of the patterns down to the size of the laser beam diameter (15 µm). Depending on the intrinsic homogeneity and porosity of sprayed mCMF and mCNF coatings, the quality and resolution of the island-like patterns is better for the mCNF coatings with thinner and more homogeneous sizes of the cellulose nanofibrils. The increase in apparent water contact angle on patterned nanocellulose coatings can be estimated from the theoretical Cassie–Baxter state of wetting and shows maximum values up to θs = 128° (mCMF coatings), or θs = 140° (mCNF coatings), for the smallest pattern sizes in parallel with minimum contact angle hysteresis of Δθ = 14° (mCMF coatings), or Δθ < 9° (mCNF coatings). The study demonstrated that femtosecond laser patterning technology provides high flexibility and adaptivity to create surface patterns in appropriate dimensions with enhanced hydrophobicity of nanocellulose coatings. Full article
(This article belongs to the Special Issue Laser Micro/Nano-Fabrication)
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22 pages, 15716 KiB  
Article
Development of a Next-Generation Cooling Channel Technology with High Cooling Efficiency by Roughing Cooling Channels Using a Combination of Laser Machining and Embossing Techniques
by Chil-Chyuan Kuo, Geng-Feng Lin, Armaan Farooqui, Song-Hua Huang and Shih-Feng Tseng
Micromachines 2025, 16(2), 225; https://doi.org/10.3390/mi16020225 - 16 Feb 2025
Viewed by 567
Abstract
This study investigates the development of a rapid wax injection tooling with enhanced heat dissipation performance using aluminum-filled epoxy resin molds and cooling channel roughening technology. Experimental evaluations were conducted on cooling channels with eleven surface roughness variations, revealing that a maximum roughness [...] Read more.
This study investigates the development of a rapid wax injection tooling with enhanced heat dissipation performance using aluminum-filled epoxy resin molds and cooling channel roughening technology. Experimental evaluations were conducted on cooling channels with eleven surface roughness variations, revealing that a maximum roughness of 71.9 µm achieved an 81.48% improvement in cooling efficiency compared to smooth channels. The optimal coolant discharge rate was determined to be 2 L/min. The heat dissipation time for wax patterns was significantly reduced, enabling a cooling time reduction of approximately 12 s per product. For a production scale of 100,000 units, this equates to a time savings of about 13 days. Empirical equations were established for estimating heat dissipation time and pressure drop, with a high coefficient of determination. This research provides a valuable contribution to the mold and dies manufacturing industry, offering practical solutions for sustainable and efficient production processes. Full article
(This article belongs to the Special Issue Laser Micro/Nano-Fabrication)
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15 pages, 1680 KiB  
Article
A Comparative Analysis of Laser-Ablated Surface Characteristics Between the Si Face and C Face of Silicon Carbide Substrates
by Hsin-Yi Tsai, Yu-Hsuan Lin, Kuo-Cheng Huang, J. Andrew Yeh, Yi Yang and Chien-Fang Ding
Micromachines 2025, 16(1), 62; https://doi.org/10.3390/mi16010062 - 1 Jan 2025
Viewed by 1247
Abstract
Silicon carbide (SiC) has significant potential as a third-generation semiconductor material due to its exceptional thermal and electronic properties, yet its high hardness and brittleness make processing costly and complex. This study introduces ultraviolet laser ablation as a method for direct SiC material [...] Read more.
Silicon carbide (SiC) has significant potential as a third-generation semiconductor material due to its exceptional thermal and electronic properties, yet its high hardness and brittleness make processing costly and complex. This study introduces ultraviolet laser ablation as a method for direct SiC material removal, investigating the effects of varying scanning speeds on surface composition, hardness, and ablation depth. The results indicate optimal processing speeds for the Si and C faces at 200 mm/s and 100 mm/s, respectively. Ablation depth is linearly correlated with laser repetitions, achieving a 25% improvement in removal efficiency at 100 mm/s on the C face compared to higher speeds. A composition analysis shows that the Si and C faces of SiC exhibit consistent ratios of Si, O, and C both before and after ablation. Post-ablation, the proportion of Si and C decreases with an increased presence of oxygen. At scanning speeds below 200 mm/s, the variation in speed has minimal effect on the compositional ratios, indicating a stable elemental distribution across the surface despite differences in processing speed. Hardness testing indicates an initial hardness of 13,896 MPa for the C face, higher than that of the Si face, with both surfaces experiencing a drop to less than 1% of their original hardness (below 50 MPa) after ablation. Lattice structure analysis shows Moissanite-5H SiC and cubic silicon formation on the Si face, while the C face retains partial SiC structure. This study found that when laser parameters are used to process SiC, the processing parameters required on both sides are different and provide important reference information for future industrial processing applications to shorten the time and process cost of SiC surface thinning. Full article
(This article belongs to the Special Issue Laser Micro/Nano-Fabrication)
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