Artificial Intelligence for Semiconductor Devices and Processes Technology: Theories, Methods and Applications
A Special Issue of Micromachines (ISSN 2072-666X) belonging to the section "D1: Semiconductor Devices".
Deadline for manuscript submissions: 31 August 2027 | Viewed by 84
Editor
Interests: machine learning; neural networks; deep learning; big data; data mining; metaheuristics and optimization
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The rapid advancement of artificial intelligence (AI) has driven transformative progress in the semiconductor field, addressing key bottlenecks of conventional trial-and-error methods in micro/nano device design, fabrication, and characterization. Core AI techniques, including data mining, machine learning, deep learning, and multi-agent intelligent systems, have proven to be powerful in solving critical technical challenges across semiconductor engineering.
This Special Issue focuses on cutting-edge AI-enabled innovations for semiconductor engineering, welcoming original research papers and reviews that bridge AI theories and practical semiconductor applications. The scope covers the full semiconductor technical chain, including intelligent device and circuit modeling, AI-optimized wafer fabrication, intelligent defect inspection for packaging and testing, and enhanced reliability prediction of semiconductor systems.
We invite high-quality submissions concerning AI algorithm optimization, methodological innovation, and practical engineering implementations for semiconductor development. Original studies featuring novel intelligent strategies and scalable industrial verification are highly encouraged.
Prof. Dr. Ping-Feng Pai
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- artificial intelligence
- semiconductor devices
- semiconductor manufacturing
- micro/nano devices
- process optimization
- defect detection
- reliability prediction
- intelligent modeling
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