Applications of Data Sciences in Semiconductor Industry: Design, Manufacturing, Packaging and Testing

Dear Colleagues,

With the rapid development of artificial intelligence in both hardware and software, the demand for semiconductors has highly increased in volume as well as function. The semiconductor theme mainly contains design, manufacturing, packaging, and testing. At the same time, the new advancements in information technology and information systems have also advanced data sciences including optimization, data mining, machine learning, deep learning, and artificial intelligence. The use of data sciences to perform data analysis represents an effective and efficient trend in many fields. The objective of this Special Issue is to utilize the latest data science techniques in the semiconductor industry, including design, manufacturing, packaging, and testing. The scope of this Special Issue is based on the application of data science approaches in coping with semiconductor industry issues.

Prof. Dr. Ping-Feng Pai
Prof. Dr. Yu-Po Wang
Guest Editors

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• data sciences
• machine/deep learning
• artificial intelligence
• optimization
• semiconductor
• integrated circuit design/manufacturing/packaging/testing
• thermal/electrical simulation
• design and advanced packaging development