Special Issue "Reliability Aspects of Lead-Free Solder Alloys Used in Electronics"

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: 30 June 2021.

Special Issue Editor

Dr. Bálint Medgyes
Guest Editor
Budapest University of Technology and Economics, Budapest, Hungary
Interests: humidity-induced failures of electronics; electrochemical migration and corrosion

Special Issue Information

Dear Colleagues,

Lead-free solder alloys are used in numerous electronic devices and systems, e.g., for interconnections, wires, surface finishes, packaging, etc. Electronic systems like IoT devices, communications networks, autonomous cars and planes, sensors and actuators are becoming more important in our everyday lives. Consequently, lead-free solder alloys as candidates for the replacement of the traditionally lead-bearing alloys should exhibit excellent mechanical, electrical, thermal, and reliability properties, in addition to having favorable economic aspects. This initiates the continuous development and preparation of new alloys via the use of novel techniques like mechanical-, micro-, and nano-alloying, which belong to a rapidly evolving multidisciplinary research field combining metallurgy, chemistry, and physics.

In many fields, electronic devices need to operate in harsh environments, so not only the quality but the long-term reliability of the applied alloys is also critical. There is a strong need to investigate the temperature- and humidity-induced failure mechanisms in these alloys, such as electrochemical migration, corrosion, intermetallic formation, and microstructural changes, and their effects on alloy properties, which affect the life-time of electronic devices. It is also necessary to examine the possible surface-preservation methods of the applied material systems against the most frequent failure mechanisms (e.g., oxidation, dendrite, and whisker growth).

This Special Issue is dedicated to disseminating the recent topics and the latest results on reliability in electronics. We invite colleagues to contribute to this Special Issue with works addressing the aforementioned topics and following keywords in the form of full papers, short communications, and reviews. The Special Issue focuses on the reliability of the lead-free solder alloys, but other related topics are also welcome!

Dr. Bálint Medgyes
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • lead-free solder alloys
  • lead-free surface finishes
  • reliability tests
  • electrochemical corrosion
  • electrochemical migration
  • whisker formation
  • intermetallic compound
  • life-time prediction

Published Papers

This special issue is now open for submission.
Back to TopTop