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Metals
Special Issues
Properties, Microstructure and Forming of Intermetallics
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Properties, Microstructure and Forming of Intermetallics

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Metal Casting, Forming and Heat Treatment".

Deadline for manuscript submissions: 31 October 2025 | Viewed by 891

Special Issue Editors

Dr. Shoujiang Qu

E-Mail Website
Guest Editor
School of Materials Science and Engineering, Tongji University, Shanghai 201804, China
Interests: Ti2AlNb alloys; TiAl alloys; titanium alloys
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Hao Wang

E-Mail Website
Guest Editor
Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110004, China
Interests: materials genome engineering; additive manufacturing; nonferrous metals and alloys; integrated computation; mechanical property
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The study of intermetallic compounds has garnered significant attention due to their unique properties, which include high melting points, excellent oxidation resistance, and superior mechanical strength. These characteristics make intermetallics ideal for applications in aerospace, automotive, and high-temperature environments. Recent research has focused on understanding their microstructure–property relationships and developing advanced forming techniques to enhance their applicability. For instance, studies on Ti-Al, Ni-Al, and Fe-Al systems have revealed that controlled microstructural modifications can significantly improve ductility and toughness. Techniques such as powder metallurgy, additive manufacturing, and hot isostatic pressing are being explored to achieve uniform and refined microstructures. Additionally, efforts are being made to optimize processing parameters to minimize defects and enhance the mechanical properties of intermetallics. Advanced characterization methods, including electron microscopy and X-ray diffraction, are being employed to analyze phase compositions and microstructural features, providing insights into the mechanisms governing their behavior. As our understanding of intermetallics deepens, these materials are poised to play a critical role in next-generation engineering applications, offering a combination of light weight and high performance. Ongoing research continues to bridge the gap between fundamental science and practical applications, paving the way for innovative solutions in materials engineering.

Dr. Shoujiang Qu
Prof. Dr. Hao Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • intermetallics
  • microstructure
  • forming
  • deformation
  • mechanical property
  • corrosion
  • oxidation

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Published Papers (3 papers)

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Research

17 pages, 25857 KiB  
Article
Dynamic Response of WMoZrNiFe Energetic Structural Material Based on SHPB
by Guiyan Pei, Zhe Peng, Xiaolu Bi, Qingjie Jiao, Rui Liu and Jianxin Nie
Metals 2025, 15(5), 516; https://doi.org/10.3390/met15050516 - 2 May 2025
Viewed by 72
Abstract
Energetic structural materials (ESMs) are widely studied due to their high energy density, which enhances their potential in various industrial and engineering applications, such as in energy absorption systems, safety devices, and structural components that need to withstand dynamic loading. A high-strength WMoZrNiFe [...] Read more.
Energetic structural materials (ESMs) are widely studied due to their high energy density, which enhances their potential in various industrial and engineering applications, such as in energy absorption systems, safety devices, and structural components that need to withstand dynamic loading. A high-strength WMoZrNiFe energetic structural material was prepared, and its mechanical properties and ignition behavior under dynamic loading were studied. Using the split-Hopkinson pressure bar (SHPB) experimental device, samples with different initial tilt angles of 0°, 30°, and 45° were dynamically loaded. The influence of the sample tilt angle on the ignition threshold was analyzed. The dynamic mechanical properties, failure modes, and ignition threshold based on the energy absorption of the WMoZrNiFe energetic structural material during the dynamic loading process were obtained. The results show that the material has a strain rate effect in the range of 1000 s−1~3000 s−1. The yield strength of the sample with a tilt angle of 0° increased from 1468 MPa to 1837 MPa, that of the sample with a tilt angle of 30° increased from 982 MPa to 1053 MPa, and that of the sample with an inclination angle of 45° increased from 420 MPa to 812 MPa. Through EDS elemental analysis, the ignition reaction mechanism of the WMoZrNiFe energetic structural material under dynamic compression was obtained. The violent reaction of the material occurred after the material fractured, and the active elements reacted with oxygen in the air. Full article
(This article belongs to the Special Issue Properties, Microstructure and Forming of Intermetallics)
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16 pages, 5388 KiB  
Article
Effects of Composition on Melt Fillability and Impact Resistance of TiAl Alloys for Thin-Blade Turbine Wheels: Laboratory Predictions and Product Verification
by Toshimitsu Tetsui, Yu-Yao Lee, Thomas Vaubois and Pierre Sallot
Metals 2025, 15(5), 474; https://doi.org/10.3390/met15050474 - 22 Apr 2025
Viewed by 178
Abstract
Scaling up the production of TiAl turbine wheels for passenger car turbochargers requires the fabrication of thin blades that are similar to those of nickel-based superalloys. To achieve this, the molten metal fillability and impact resistance of thin blades must be improved. In [...] Read more.
Scaling up the production of TiAl turbine wheels for passenger car turbochargers requires the fabrication of thin blades that are similar to those of nickel-based superalloys. To achieve this, the molten metal fillability and impact resistance of thin blades must be improved. In this study, the effects of composition on these properties are predicted using simple laboratory experiments with binary, ternary, and practical alloys and are then verified with actual turbine wheels. The melt fillability of the turbine wheel blade is predicted using the amount of molten metal passing through an Al2O3-1%SiO2 mesh. The binary alloy exhibits the best fillability, which is reduced by the addition of Cr and Si. Charpy impact tests on as-cast materials at 25 and 850 °C show that the addition of Cr and Mn improves the impact resistance, but the addition of Nb, W, Mo and Si reduces it. Therefore, the molten metal fillability and/or impact resistance of practical TiAl alloys containing such additives owing to other requirements are low and require improvement for use in thin-blade turbine wheel applications. Full article
(This article belongs to the Special Issue Properties, Microstructure and Forming of Intermetallics)
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28 pages, 11152 KiB  
Article
In-Depth DFT-Based Analysis of the Structural, Mechanical, Thermodynamic, and Electronic Characteristics of CuP2 and Cu3P: Insights into Material Stability and Performance
by Ching-Feng Yu and Hsien-Chie Cheng
Metals 2025, 15(4), 369; https://doi.org/10.3390/met15040369 - 27 Mar 2025
Viewed by 301
Abstract
This study employed density functional theory (DFT) to investigate the structural, mechanical, thermodynamic, and electronic properties of monoclinic CuP2 and hexagonal Cu3P. The analysis confirmed the mechanical stability of both compounds, with distinct anisotropic behaviors arising from crystallographic symmetries. Cu [...] Read more.
This study employed density functional theory (DFT) to investigate the structural, mechanical, thermodynamic, and electronic properties of monoclinic CuP2 and hexagonal Cu3P. The analysis confirmed the mechanical stability of both compounds, with distinct anisotropic behaviors arising from crystallographic symmetries. Cu3P exhibits a higher bulk modulus (130.1 GPa), indicating superior resistance to volumetric compression, while CuP2 demonstrates greater shear (52.9 GPa) and Young’s moduli (133.3 GPa), reflecting enhanced stiffness and tensile resistance. The K/G ratio (1.749 for CuP2 vs. 3.120 for Cu3P) and Cauchy pressure analyses revealed the brittle nature of CuP2, with covalent bonding, and the ductility of Cu3P, with metallic bonding. The thermodynamic evaluations highlighted the higher Debye temperature of CuP2 (453.1 K) and its lattice thermal conductivity (8.37 W/mK), suggesting superior heat dissipation, whereas Cu3P shows greater thermal expansion (38.4 × 10−6/K) and a higher volumetric heat capacity (3.29 × 106 J/m3K). The electronic structure calculations identified CuP2 as a semiconductor with a 0.824 eV bandgap and Cu3P as a conductor with metallic states at the Fermi level. These insights are critical for optimizing Cu-P compounds in microelectronic packaging, where thermal management and mechanical reliability are paramount. Full article
(This article belongs to the Special Issue Properties, Microstructure and Forming of Intermetallics)
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