Special Issue "Metamaterials and Devices"
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: 31 October 2018
Prof. Eduard Karpov
The purpose of this Special Issue is to highlight recent advances in mechanical metamaterials, engineered structural composites and material systems with dramatically enhanced mechanical properties, or properties nonexistent in natural materials. Examples include negative elastic moduli, negative compressibility, negative thermal expansion, reverse Saint-Venant effect, surface localization of vibration and deformation energy, acoustic and mechanical rectifiers and by-passers. These properties are obtained via smart geometric arrangements of material’s constitutive elements, rather than their composition.
This Special Issue covers all aspects of mechanical metamaterials research with an emphasis on understanding basic physical phenomena that determine metamaterials functionality, understanding the role of structural hierarchy, phase transitions maps, design approaches, novel manufacturing methods, and numerical modelling methods.
Prof. Eduard Karpov
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- mechanical metamaterial
- reverse elastic properties
- smart structure
- multistable structure
- structural composite
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
1. Authors: Larry A. Danso, Eduard G. Karpov (corresponding author)
Affiliation: Department of Civil and Materials Engineering, College of Engineering, University of Illinois at Chicago, Chicago, IL 60607, USA