Special Issue "Advances in Thermoset Materials"
Deadline for manuscript submissions: 15 July 2020.
Interests: actively moving polymers; functional materials; advanced thermosets; vitrimers; dual curing; mechanical characterization; thermal characterization
Interests: epoxy thermosets; click-crosslinkable materials; dual curing; curing mechanisms; structural characterization; spectroscopy; synthesis of monomers; ring-opening polymerization; hyperbranched polymers; star polymers; mechanical characterization; thermal characterization
Special Issues and Collections in MDPI journals
With the invention of Bakelite—one of the most used and known thermosets—in the early 20th century, this type of material burst into our daily live and is, nowadays, almost essential.
Up to now, the applications of thermoset materials has spread from conventional to advanced materials. They have been widely used as adhesives, matrices for fiber-reinforced composites, surface coatings, insulating materials, and electronic encapsulation, among others. However, the most recent research has focused on more advanced and novel applications, such as in actively moving polymers, smart materials and actuators, encapsulation, or, the most cutting-edge evolution of thermosets, e.g., in vitrimers and 3D printing.
This Special Issue aims to present new research toward improving all types of thermosets, especially those designed for advanced technologies. Potential topics include, but are not limited to:
- Advances in curing processes, such as dual curing or frontal polymerization, for new processing technologies;
- Innovations in processing technologies such as visible light radiation or electron beams for applications in high-tech domains;
- New bio-based thermosets for minimizing energy and oil consumption;
- Innovations in formulation, such specific additives or modifiers, and new catalysts and initiators for improved thermosets;
- New strategies for recycling or reuse of thermosets like reversible or exchangeable covalent bonds;
- Recent advances in actively moving polymers, shape memory polymers, or shape-changing polymers, from different chemistries or material selection for enhanced shape memory performance to advances in device design.
Dr. Silvia De la Flor López
Prof. Angels Serra
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- 3D printing
- dual curing
- smart materials
- shape memory polymers
- actively moving polymers
- covalent adaptable networks
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
Title: Influence of morphology on the healing mechanism of PCL/epoxy blends
Authors: Alberto Jiménez Suárez, Gilberto Del Rosario Hernández, Xoan Xosé Fernández Sánchez-Romate, Silvia González Prolongo
Abstract: Thermosetting/Thermoplastic blends of epoxy resin with polycaprolactone (PCL) have been manufactured modifying the amine hardener. The different gel time of the studied epoxy/amine systems induces an important modification of the morphology of blends, which is formed by phase separation induced by chemical reaction. This causes a modification of the critical composition, the size of separated thermoplastic phase and the morphology of the critical blends.
Polycaprolactone is used as thermoplastic modifier of epoxy resin due to the increase of toughness of the thermosetting resin and its lower melting point. This last property gives self-healing capability. The efficiency of self-healing is studied as a function of the blend morphology, confirming that the highest efficiency is reached when the blend is constituted by epoxy matrix with separated thermoplastic phase but the thermoplastic concentration is close to the critical composition because of the size of self-healable phase is higher.
Title: Recent trends in applying ortho-nitrobenzyl esters for the design of photo-responsive polymer networks
Authors: S. Schoegl (a), I. Roppolo (b), A. Romano (b), E. Rosseger (a), M. Sangermano (b).
(a) Polymer Competence Center Leoben GmbH, Roseggerstrasse 12, A-8700 Leoben, Austria
(b) Department of Applied Science and Technology, Politecnico di Torino, Corso Duca degli Abruzzi 24, 10129 Torino, Italy
Title: Thermal conductivity of epoxy-BN composites: a review
Authors: John M Hutchinson (*) and Sasan Moradi
Departament de Màquines i Motors Tèrmics, ESEIAAT, Universitat Politècnica de Catalunya, C/Colom 11, 08222 Terrassa, Spain
Abstract: Composites of epoxy resin filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride, BN. In this Review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications.
The principal aspects that will be discussed in terms of their effect on the thermal conductivity will include the following: the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles; the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. Other aspects will include the possibility of orientation of the filler particles, the use of hybrids and synergistic effects, and the use of pressure during cure, and the composite fabrication process will be discussed with reference to the epoxy cure kinetics. Theoretical equations describing the relationship between thermal conductivity and filler content and type will also be discussed.