Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review
Departament de Màquines i Motors Tèrmics, ESEIAAT, Universitat Politècnica de Catalunya, Carrer Colom 11, 08222 Terrassa, Spain
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Materials 2020, 13(16), 3634; https://doi.org/10.3390/ma13163634
Received: 30 June 2020
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Revised: 2 August 2020
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Accepted: 9 August 2020
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Published: 17 August 2020
(This article belongs to the Special Issue Advances in Thermoset Materials)
Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.
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Keywords:
epoxy; boron nitride; thermal conductivity; cure kinetics
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MDPI and ACS Style
Hutchinson, J.M.; Moradi, S. Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review. Materials 2020, 13, 3634. https://doi.org/10.3390/ma13163634
AMA Style
Hutchinson JM, Moradi S. Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review. Materials. 2020; 13(16):3634. https://doi.org/10.3390/ma13163634
Chicago/Turabian StyleHutchinson, John M., and Sasan Moradi. 2020. "Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review" Materials 13, no. 16: 3634. https://doi.org/10.3390/ma13163634
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