The 44th IMAPS Poland Conference
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: closed (30 September 2021) | Viewed by 18278
Special Issue Editors
Interests: soldering; heat and mass transfer; reliability; metallurgy
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Special Issue Information
Dear Colleagues,
The International Microelectronics and Packaging Society (IMAPS) Poland Chapter Conference is one of the most significant conferences with an international range, bringing together students, scientists, and experts in the field of microelectronics from around the world. The conference represents a high level of invited papers and is annually supported by different JCR journals. Each year, the conference is organized by a different research institution that is a member of an IMAPS Poland Chapter, in various places in Poland. This year, the IMAPS Poland Conference is co-organized by Łukasiewicz Research Network and the Institute of Micorelectronics and Phototnics. The event will take place online due to the COVID-19 pandemic. The main themes of the conference are hybrid and semiconductor technologies, design methods and computer simulations, electronic materials and components, thick-film and thin-film technologies, sensors, packaging, thermal management, optoelectronics, and photovoltaics. The most important goals of the IMAPS Poland Conference are to provide a forum for knowledge development and exchange on microelectronics technology and to encourage researchers (especially early career researchers) to develop interest and engagement in the field of electrical engineering.
Prof. Dr. Balázs Illés
Dr. Skwarek Agata
Guest Editors
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Keywords
- microelectronics
- packaging
- semiconductors
- sensors
- photovoltaics
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