Special Issue "Environmentally-Induced Failures of Electronic Grade Alloys and Coatings"
Deadline for manuscript submissions: closed (31 December 2020).
Interests: quality assurance in microelectronics; electronics manufacturing; technological process modeling
Electronic-grade alloys are used in numerous electronic devices and systems, e.g., for interconnections, anodes, wires, surface coatings, fuel cells, batteries, solar cells, packaging, and lids. Electronic systems—like IoT devices, communications networks, autonomous cars, sensors, and actuators—are becoming more important in our everyday lives. Consequently, electronic-grade alloys should exhibit excellent mechanical, electrical, thermal, and reliability properties. This initiates the continuous development and preparation of new alloys via the use of novel techniques, like mechanical-, micro-, and composite-alloying, which belong to a rapidly evolving multidisciplinary research field combining metallurgy, chemistry, and physics.
In many fields, electronic devices need to operate in harsh environments, so not only the quality but the long-term reliability of the applied alloys is also critical. There is a strong need to investigate the environmentally induced failure mechanisms in these alloys, like corrosion, intermetallic formation, and microstructural changes, and their effects on alloy properties, which affect the life-time of electronic devices, and for examining the possible surface preservation methods of the applied material systems against the most frequent failure mechanisms like oxidation, dendrite, and whisker growth.
This Special Issue is dedicated to disseminating the recent advancements and latest results in this rapidly evolving interdisciplinary research field. We invite colleagues to contribute to this Special Issue in the aforementioned topics and keywords with full papers, short communications, and reviews. The Special Issue focuses on electronic-grade alloys, but other related topics are also welcome!
Dr. Balázs Illés
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Electronic-grade alloys
- Coatings and surface preservation
- Dendrites and whiskers
- Alloy properties
- Allotrope transition
- Soldering and packaging
- Fuel cells and batteries
- Solar cells.