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Silicon Carbide: Material Growth, Device Processing and Applications

This special issue belongs to the section “Electronic Materials“.

Special Issue Information

Dear Colleagues,

Owing to its superior performance and higher energy efficiency with respect to silicon, silicon carbide (SiC) plays a pivotal role in modern power electronics, where it can be used in energy conversion systems, electric vehicles, transportation, etc.

Although commercial SiC (the 4H-SiC polytype) material quality and device technology are already mature and a large variety of devices are already on the market, considerable efforts are still being dedicated to further improving device performance across several application areas. For this purpose, a deeper understanding of the material properties, processing issues and device physics is required, which can also pave the way for the applications in other fields, such as quantum technologies, sensing and detecting.

This Special Issue is aimed at collecting papers on silicon carbide, covering relevant aspects from material growth through to device processing and applications.

The topics covered by the Special Issue include, but are not limited to:

  • Bulk and epitaxial growth of SiC materials;
  • Material characterization;
  • Surfaces and interfaces in SiC devices;
  • Fabrication processing (contacts, implantation doping, gate oxides, etc.);
  • Power devices (Schottky Diodes, JBS, MOSFETs, BJT, etc.);
  • Modelling and reliability;
  • System applications (electric vehicles, railway, avionic, energy conversion, sensors, detectors, etc.);
  • Radiation hardness of 4H-SiC devices.

Both concise reviews and original articles on new findings are welcome.

Dr. Marilena Vivona
Dr. Mike Jennings
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • silicon carbide
  • homoepitaxial and heteroepitaxial growth
  • device processing
  • power- and high-frequency electronics
  • schottky diodes and MOSFETs
  • optoelectronics
  • sensors
  • detectors
  • metal/semiconductor interfaces

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Materials - ISSN 1996-1944