Special Issue "Electrical Conductive Polymer Nanocomposites"
Deadline for manuscript submissions: 31 July 2020.
Interests: polymer composites and blends; rheology; structure–properties relationships
Electrically conductive polymer composites are materials drawing a significant scientific attention in recent decades. These heterogeneous systems consisting of an insulating polymer matrix and a conductive filler are used in large-scale applications such as antistatic packaging and electromagnetic shielding. Today, the application spectrum of conductive polymer composites broadens because they are considered as perspective materials for the production of sensors in biomedicine, smart textiles or radiation protection. To obtain electrically conductive material, filler particles have to form a continuous network in a polymer matrix. However, the presence of this network impairs the processability of the composites significantly. For this reason and because of the usually high cost of conductive nanofillers, a large number of studies have been devoted to the preparation of composites with the lowest possible percolation threshold, for example, using fillers with high aspect ratios or ensuring selective localization of filler particles in polymer matrices. At low filler contents, particle structures are very fragile, however, and can be destroyed easily by applying external stress, which can be advantageous for sensors but limiting for other applications. Therefore, fundamental understanding of relationships between structure of conductive particle networks including mechanisms of their formation and behavior of conductive polymer composites is necessary for the creation of new materials with final properties tailored to the needs of specific application.
It is my great pleasure to serve as a guest editor of this Special Issue, which aims to catch recent advances and trends in the field of electrically conductive polymer composites. Original research articles and reviews covering the preparation, characterization, and application of these smart multifunctional materials are welcome.
Dr. Zdenek Stary
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- electrical conductivity
- percolation threshold
- electromagnetic shielding
- antistatic materials