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Advances in Thermal Management and Reliability of Electronic Systems
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Advances in Thermal Management and Reliability of Electronic Systems

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "F: Electrical Engineering".

Deadline for manuscript submissions: 30 September 2026 | Viewed by 4026

Special Issue Editor

Prof. Dr. Vincenzo d'Alessandro

E-Mail Website
Guest Editor
Department of Electrical Engineering and Information Technology, University Federico II, Via Claudio 21, 80125 Naples, Italy
Interests: bipolar transistors; power devices; photovoltaics; microelectronics; semiconductor devices
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

THERMINIC is the leading European workshop on thermal and reliability issues in electronic components and systems, and includes topics such as multiphysics simulation and modeling; thermal, thermo-mechanical, and reliability-related measurements; thermal characterization; and lifetime prediction issues.

For this Special Issue, we welcome submissions of updated versions of the papers presented at THERMINIC 2025 ,or indeed any paper (including those not presented at THERMINIC) related to the above topics.

Accepted and finalized papers will be published immediately in Energies.

Prof. Dr. Vincenzo d'Alessandro
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electronic components and systems
  • multiphysics simulation and modeling
  • thermal characterization
  • ther-mo-mechanical and reliability-tested measurements
  • thermal resistance
  • thermally-induced reliability degradation

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Published Papers (3 papers)

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Research

11 pages, 2889 KB  
Article
The Impact of Heat Transfer Coefficient Value on Temperature of Hybrid Electronic Circuits Cooled by Natural Convection
by Marcin Janicki
Energies 2026, 19(4), 1007; https://doi.org/10.3390/en19041007 - 14 Feb 2026
Viewed by 405
Abstract
This paper discusses the problem of modeling heat transfer coefficient values in electronic circuits cooled by natural convection. This coefficient represents the heat exchange between the outer circuit surfaces and the surrounding environment, and in thermal simulations, their value is quite often assumed [...] Read more.
This paper discusses the problem of modeling heat transfer coefficient values in electronic circuits cooled by natural convection. This coefficient represents the heat exchange between the outer circuit surfaces and the surrounding environment, and in thermal simulations, their value is quite often assumed to be constant. However, in reality, it depends on both the absolute temperature of a surface and the temperature difference between this surface and the ambient. Consequently, this assumption may lead to important simulation errors, especially when a heat source occupies only a small part of the circuit’s area. This issue is illustrated here based on the results of thermal simulations carried out for a hypothetical test structure containing a heat source that dissipates different amounts of power, has variable dimensions, and is placed in various locations. Moreover, the thermal coupling between two heat sources is also analyzed as a function of their spacing. The simulation results are compared and analyzed for cases when the heat transfer coefficient value is constant and when it is temperature-dependent. The main conclusions of the analyses are that the simulated circuit temperature values are much lower when temperature-dependent values of the coefficient used and that proper optimization of the circuit layout could substantially decrease the maximal and average circuit temperature values. Full article
(This article belongs to the Special Issue Advances in Thermal Management and Reliability of Electronic Systems)
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15 pages, 10531 KB  
Article
Sensorless Dual TSEP (Vth, Rdson) Implementation for Junction Temperature Measurement in Parallelized SiC MOSFETs
by Louis Alauzet, Patrick Tounsi and Jean-Pierre Fradin
Energies 2025, 18(13), 3470; https://doi.org/10.3390/en18133470 - 1 Jul 2025
Viewed by 1101
Abstract
This article presents a method for detecting the temperature distribution of two parallelized Silicon Carbide (SiC) MOSFETs. Two thermally sensitive electrical parameters (TSEPs), namely the on-state resistance (Rdson) and the threshold voltage (Vth), [...] Read more.
This article presents a method for detecting the temperature distribution of two parallelized Silicon Carbide (SiC) MOSFETs. Two thermally sensitive electrical parameters (TSEPs), namely the on-state resistance (Rdson) and the threshold voltage (Vth), are introduced. A comparison of the temperatures interpolated by Vth and Rdson shows disparity, enabling the detection of individual junction temperatures. Vth instability and its measurement are discussed for SiC devices. Experimental results show that, depending on the instability of the Vth and the sensitivity of the two TSEPs at certain temperatures, a combination of different TSEPs could be a solution for extracting the maximum junction temperature of parallelized devices. Full article
(This article belongs to the Special Issue Advances in Thermal Management and Reliability of Electronic Systems)
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15 pages, 6416 KB  
Article
A Cost-Driven Analysis of Thermal Performance in Power Modules
by Ciro Scognamillo, Antonio Pio Catalano, Lorenzo Codecasa, Alberto Castellazzi and Vincenzo d’Alessandro
Energies 2025, 18(7), 1665; https://doi.org/10.3390/en18071665 - 27 Mar 2025
Cited by 3 | Viewed by 1619
Abstract
This paper offers an in-depth overview of the trade-off between thermal performance and assembly cost in state-of-the-art power modules (PMs). Since the development of the PM technological process is still in its infancy, PMs are typically designed and prototyped in order to evaluate [...] Read more.
This paper offers an in-depth overview of the trade-off between thermal performance and assembly cost in state-of-the-art power modules (PMs). Since the development of the PM technological process is still in its infancy, PMs are typically designed and prototyped in order to evaluate their electrical/thermal characteristics. The numerical investigation conducted here aims to analyze the impact of design choices (e.g., assembly materials and dimensions, cooling system efficiency) on the thermal resistance (RTH, [K/W]), thermal time constant (τ, [s]), and overall cost (PMcost, [$]) of semiconductor devices integrated in both single- and double-sided cooled PMs, without any need for prototyping stages. The influence of the thicknesses of the copper and ceramic layers is explored, since they play a relevant role in defining the thermal ratings, as well as the electrical and mechanical characteristics, of the assemblies. The benefits deriving from thicker layers are then weighed against the cost of materials, and figures of merit are defined to evaluate the trade-offs between cost and thermal behavior. The impact of two cooling solutions—passive heatsink and forced liquid—is also taken into account. Full article
(This article belongs to the Special Issue Advances in Thermal Management and Reliability of Electronic Systems)
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