Ultra-Wideband Microwave/MM-Wave Components and Packaging

Dear Colleagues,

The emerging wireless communication and sensor applications increasingly require higher data rates and larger bandwidths, which necessitate the development of practical ultra-wideband (UWB) microwave/millimeter-wave components, modules, and systems. High-speed digital signals occupy a very wide bandwidth, and require UWB transmission lines and components to propagate with minimal signal distortion. Microwave and millimeter-wave components with several or 10s of GHz bandwidth will find new communication and sensor applications beyond the conventional 3.1–10.6 GHz UWB communications. In particular, packaging of the UWB high-frequency components/devices for maximum data transfer is one of the most pressing design issues.

Possible application areas using the ultra-wideband components are ultra-high-speed wireless communications, biomedical applications such as radar monitoring human vital signs, signal receivers/analyzers, precision location/tracking systems, ground- or wall-penetrating radars, and microwave imaging. The required components for the UWB microwave/mm-wave systems include ultra-wideband baluns, transitional structures, couplers, filters, mixers, amplifiers, transceivers, antennas, etc. The issues of UWB components may include improving performance, increasing bandwidth, lowering manufacturing cost, reducing size, designing with analytical models, and adopting novel design approaches.

This Special Issue focuses on the analysis, design, and implementation of ultra-wideband microwave and mm-wave components for modern wireless communication and sensor applications.

The topics of interest include, but are not limited to:

• analysis and design of ultra-wideband baluns and transitions;
• ultra-wideband component design techniques;
• design of ultra-wideband microwave/mm-wave power divider, couplers, filters, mixers, amplifiers, and transceivers;
• ultra-wideband RFIC/MMIC chips;
• various ultra-wideband microwave/mm-wave components;
• modeling and design of ultra-wideband antennas and their arrays;
• ultra-wideband MIMO antennas;
• ultra-wideband packaging and integration of active/passive RF devices

Prof. Dr. Kang Wook Kim
Guest Editor

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