Imaging Based Material Characterization of Electronics and Their Applications

Dear Colleagues,

Seeing is believing. There is no doubt that imaging is one of the most powerful characterization methods that is applicable to a wide range of different materials, including electronics, construction materials, natural ores, as well as industrial wastes.

This Special Issue aims to provide an excellent forum for scientists and engineers to share and exchange their latest contributions on the imaging base material characterizations of electronics and their applications. Within this context, original articles as well as insightful review articles are expected.

The development of new imaging methods and/or the combination of multiple supplemental imaging (and other) characterization methods for complex/functional materials used in consumer electronics in order to have a better insight into/opportunity of achieving eco-design and/or recycling is particularly welcome. A proper characterization of such complex materials is still a complicated and challenging task, since the majority of the characterization methods available in the market provide either an average property regardless of material/element spatial heterogeneity or the information within a very focused/tiny area (e.g., [1,2]). On the other hand, submissions that are relevant to many other areas of imaging electronics are also highly appreciated. You can find some potential contributions under “keywords”.

We look forward to receiving your contributions, and to future collaborations.

Thank you for your cooperation.

Best regards, 

Dr. Akira Otsuki
Guest Editor

References

[1] Otsuki, A.; Chen, Y.; Zhao, Y. Characterisation and beneficiation of complex ores for sustainable use of mineral resources: Refractory gold ore beneficiation as an example. Int. J. Soc. Mat. Eng. Res. 2014, 20, 126–135.

[2] Otsuki, A. Non-destructive liberation analysis of printed circuit board, Proc. 16th International Waste Management and Landfill Symposium, Sardinia 2017, Sardinia, 2-6 October 2017.

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