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Article

Microstructural and Energy-Dispersive X-ray Analyses on Argon Ion Implantations in Tantalum Thin Films for Microelectronic Substrates

by
Amir Hoshang Ramezani
1,*,
Siamak Hoseinzadeh
2,*,
Zhaleh Ebrahiminejad
1,
Milad Sangashekan
3,4 and
Saim Memon
5
1
Department of Physics, West Tehran Branch, Islamic Azad University, Tehran 19393-34651, Iran
2
Department of Planning, Design, and Technology of Architecture, Sapienza University of Rome, Via Flaminia 72, 00196 Rome, Italy
3
Department of Chemical Engineering, University of Guilan, Rasht 41635-3756, Iran
4
Nano Mila Paint Company, Sari 48187-46747, Iran
5
London Centre for Energy Engineering, Electrical and Electronic Engineering Division, School of Engineering, London South Bank University, London SE1 0AA, UK
*
Authors to whom correspondence should be addressed.
Electronics 2021, 10(23), 2941; https://doi.org/10.3390/electronics10232941
Submission received: 15 October 2021 / Revised: 22 November 2021 / Accepted: 24 November 2021 / Published: 26 November 2021

Abstract

In the present study, the microstructural and statistical properties of unimplanted in comparison to argon ion-implanted tantalum-based thin film surface structures are investigated for potential application in microelectronic thin film substrates. In the study, the argon ions were implanted at the energy of 30 keV and the doses of 1 × 1017, 3 × 1017, and 7 × 1017 (ion/cm2) at an ambient temperature. Two primary goals have been pursued in this study. First, by using atomic force microscopy (AFM) analysis, the roughness of samples, before and after implantation, has been studied. The corrosion apparatus wear has been used to compare resistance against tantalum corrosion for all samples. The results show an increase in resistance against tantalum corrosion after the argon ion implantation process. After the corrosion test, scanning electron microscopy (SEM) analysis was applied to study the sample morphology. The elemental composition of the samples was characterized by using energy-dispersive X-ray (EDX) analysis. Second, the statisticalcharacteristics of both unimplanted and implanted samples, using the monofractal analysis with correlation function and correlation length of samples, were studied. The results show, however, that all samples are correlated and that the variation of ion doses has a negligible impact on the values of correlation lengths. Moreover, the study of height distribution and higher-order moments show the deviation from Gaussian distribution. The calculations of the roughness exponent and fractal dimension indicates that the implanted samples are the self-affine fractal surfaces.
Keywords: argon ion; implantation; tantalum; AFM; corrosion; monofractal; roughness argon ion; implantation; tantalum; AFM; corrosion; monofractal; roughness

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MDPI and ACS Style

Ramezani, A.H.; Hoseinzadeh, S.; Ebrahiminejad, Z.; Sangashekan, M.; Memon, S. Microstructural and Energy-Dispersive X-ray Analyses on Argon Ion Implantations in Tantalum Thin Films for Microelectronic Substrates. Electronics 2021, 10, 2941. https://doi.org/10.3390/electronics10232941

AMA Style

Ramezani AH, Hoseinzadeh S, Ebrahiminejad Z, Sangashekan M, Memon S. Microstructural and Energy-Dispersive X-ray Analyses on Argon Ion Implantations in Tantalum Thin Films for Microelectronic Substrates. Electronics. 2021; 10(23):2941. https://doi.org/10.3390/electronics10232941

Chicago/Turabian Style

Ramezani, Amir Hoshang, Siamak Hoseinzadeh, Zhaleh Ebrahiminejad, Milad Sangashekan, and Saim Memon. 2021. "Microstructural and Energy-Dispersive X-ray Analyses on Argon Ion Implantations in Tantalum Thin Films for Microelectronic Substrates" Electronics 10, no. 23: 2941. https://doi.org/10.3390/electronics10232941

APA Style

Ramezani, A. H., Hoseinzadeh, S., Ebrahiminejad, Z., Sangashekan, M., & Memon, S. (2021). Microstructural and Energy-Dispersive X-ray Analyses on Argon Ion Implantations in Tantalum Thin Films for Microelectronic Substrates. Electronics, 10(23), 2941. https://doi.org/10.3390/electronics10232941

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