Innovations and Challenges in Automotive Mobility and Automation Systems

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Electrical and Autonomous Vehicles".

Deadline for manuscript submissions: 25 October 2026 | Viewed by 402

Special Issue Editors


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Guest Editor
Department of Automotive Engineering and Transports, Technical University of Cluj-Napoca, 400641 Cluj-Napoca, Romania
Interests: virtual model for electric vehicles; autonomous vehicles; fuel cell vehicles; powertrain concept; electronic control unit; in-vehicle communication network; energy efficiency; computer modeling and simulation in the automotive field
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Automotive Engineering and Transports, Technical University of Cluj-Napoca Romania, 400114 Cluj-Napoca, Romania
Interests: system control; electric vehicles; hybrid vehicles; urban mobility; MATLAB

Special Issue Information

Dear Colleagues,

The Automotive Mobility, Management and Automation (AMMA 2025) Congress, hosted by the Technical University of Cluj-Napoca, Romania, on 23–25 October 2025, offers an opportunity to present recent technical and/or scientific developments.

This Special Issue aims to compile recent research and technological advancements in the fields of automotive mobility, intelligent management, and automation systems. With the rapid evolution of connected, autonomous, and electric vehicles, the automotive industry is undergoing a transformative shift. This Special Issue therefore welcomes original contributions that address innovative technologies, cutting-edge methodologies, and practical applications that are shaping the future of mobility. The scope of this Special Issue include, but is not limited to, advancements in autonomous driving, vehicle-to-everything (V2X) communication, electric and hydrogen-powered vehicles, intelligent transportation systems, sustainable mobility solutions, and the integration of AI and machine learning in vehicle systems.

The Special Issue also explores challenges related to the assurance of ensuring safety, reliability, and regulatory compliance in the deployment of these technologies. While it features selected contributions from the AMMA 2025 International Congress, we welcome submissions from all researchers and practitioners who are pushing the boundaries of automotive innovation. This platform aims to foster knowledge exchange and collaboration among academics, industry experts, and policymakers, contributing to the global transition towards smarter, greener, and safer mobility solutions.

We encourage scholars from diverse disciplines to share their insights and shape the future of the automotive industry. In this Special Issue, original research articles and reviews are welcome.

We look forward to receiving your contributions.

Dr. Calin Iclodean
Dr. Dan Moldovanu
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced engineering
  • software and simulation
  • cybersecurity in automotive
  • green vehicle solutions
  • hybrid and electric vehicles
  • manufacturing technologies and materials
  • powertrain and propulsion
  • road safety
  • traffic management and transportation engineering

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Published Papers (1 paper)

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Research

29 pages, 1326 KiB  
Article
A Coordination Layer for Time Synchronization in Level-4 Multi-vECU Simulation
by Hyeongrae Kim, Harim Lee and Jeonghun Cho
Electronics 2025, 14(8), 1690; https://doi.org/10.3390/electronics14081690 - 21 Apr 2025
Viewed by 132
Abstract
In automotive software development, testing and validation workloads are often concentrated at the end of the development cycle, leading to delays and late-stage issue discovery. To address this, virtual Electronic Control Units (vECUs) have gained attention for enabling earlier-stage verification. In our previous [...] Read more.
In automotive software development, testing and validation workloads are often concentrated at the end of the development cycle, leading to delays and late-stage issue discovery. To address this, virtual Electronic Control Units (vECUs) have gained attention for enabling earlier-stage verification. In our previous work, we developed a Level-4 vECU using a hardware-level emulator. However, when simulating multiple vECUs with independent clocks across distributed emulators, we observed poor timing reproducibility due to the lack of explicit synchronization. To solve this, we implemented an integration layer compliant with the functional mock-up interface (FMI), a widely used standard for simulation tool interoperability. The layer enables synchronized simulation between a centralized simulation master and independently running vECUs. We also developed a virtual CAN bus model to simulate message arbitration and validate inter-vECU communication behavior. Simulation results show that our framework correctly reproduces CAN arbitration logic and significantly improves timing reproducibility compared to conventional Linux-based interfaces. To improve simulation performance, the FMI master algorithm was parallelized, resulting in up to 85.2% reduction in simulation time with eight vECUs. These contributions offer a practical solution for synchronizing distributed Level-4 vECUs and lay the groundwork for future cloud-native simulation of automotive systems. Full article
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