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Electronics
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5G/6G IoT: Smart RF Link Integrated Circuit System Design
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5G/6G IoT: Smart RF Link Integrated Circuit System Design

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".

Deadline for manuscript submissions: closed (30 June 2021) | Viewed by 3852

Special Issue Editor

Prof. Dr. Gyung-Su Byun

E-Mail Website
Guest Editor
College of Engineering, Inha University, Incheon 22212, Korea
Interests: RF/Analog IC design for energy-efficient wireless/wireline communication; RF/THz electronics for sensing/imaging; biomedical applications

Special Issue Information

Dear Colleagues,

5G/6G heterogeneous computing and communication systems will be one of the most important technologies for autonomous vehicles and smart mobility systems. To enable those systems, innovative 5G/6G RF IC and system-on-chip (SoC), and application-specific integrated circuits (ASIC) designs will be needed to improve far beyond mobile communication links by high-performance RF integrated transceivers, transmitters, and receivers design.

This Special Issue focuses on the analysis, design, and implementation of RF/analog integrated circuit design for energy-efficient wireless/wireline communication, RF/THz electronics for sensing/imaging, biomedical applications, etc.

Prof. Dr. Gyung-Su Byun
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 5G/6G heterogeneous computing and communication system
  • High-performance RF integrated transceivers
  • High-performance transmitters and receivers
  • Analog integrated circuit design for wireless/wireline communication
  • RF/THz electronics for sensing/imaging
  • biomedical applications.

Published Papers (1 paper)

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Research

13 pages, 9496 KiB  
Article
A Sub-THz Wireless Power Transfer for Non-Contact Wafer-Level Testing
by Hanh Dang-ba and Gyung-su Byun
Electronics 2020, 9(8), 1210; https://doi.org/10.3390/electronics9081210 - 28 Jul 2020
Cited by 2 | Viewed by 3151
Abstract
In this paper, a sub-THz wireless power transfer (WPT) interface for non-contact wafer-level testing is proposed. The on-chip sub-THz couplers, which have been designed and analyzed with 3-D EM simulations, could be integrated into the WPT to transfer power through an air media. [...] Read more.
In this paper, a sub-THz wireless power transfer (WPT) interface for non-contact wafer-level testing is proposed. The on-chip sub-THz couplers, which have been designed and analyzed with 3-D EM simulations, could be integrated into the WPT to transfer power through an air media. By using the sub-THz coils, the WPT occupies an extremely small chip size, which is suitable for future wafer-testing applications. In the best power transfer efficiency (PTE) condition of the WPT, the maximum power delivery is limited to 2.5 mW per channel. However, multi-channel sub-THz WPT could be a good solution to provide enough power for testing purposes while remaining high PTE. Simulated on a standard 28-nm CMOS technology, the proposed eight-channel WPT could provide 20 mW power with the PTE of 16%. The layouts of the eight-channel WPT transmitter and receiver occupy only 0.12 mm2, 0.098 mm2, respectively. Full article
(This article belongs to the Special Issue 5G/6G IoT: Smart RF Link Integrated Circuit System Design)
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