Electronic Materials, Volume 6, Issue 4
2025 December - 11 articles
Cover Story: This cover captures the shift from transistor scaling to system-level integration through advanced packaging. A 3D heterogeneous die stack and interconnect evolution illustrate microbump scaling below 5 µm interconnect pitch. The design reflects comprehensive modeling of thermal cycling, intermetallic growth, fatigue-creep and thermal performance analysis of solder-based thermo-compression bonding (TCB) and Cu–Cu TCB. The paper highlights the markedly superior reliability and lifetime of Cu–Cu thermo-compression bonding compared to conventional solder-based off-chip interconnections. View this paper - Issues are regarded as officially published after their release is announced to the table of contents alert mailing list .
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