Residual Stress Effects in Advanced Manufacturing and Electronics Packaging

Dear Colleagues,

Advanced manufacturing and electronics packaging are rapidly progressing multidisciplinary fields involving materials science, electronics and electrical engineering, mechanical engineering, advanced manufacturing, etc., which have drawn the attention of researchers from all around the world. In particular focus is the mechanical performance of crystals, such as metals and semiconductor materials, adopted in advanced manufacturing and electronics packaging. One of the most crucial and challenging topics is the residual stress effects introduced during the manufacturing and fabrication processes, which can significantly affect the mechanical performance and the lifetime of materials under harsh and extreme conditions. Although residual stress effects on mechanics of material, structural integrity, durability, and reliability in advanced manufacturing and electronics packaging have gained enormous interest in recent years, accurate and efficient evaluations of residual stress effects are still paradigmatic in this field. In particular, along with the development of Moore’s law and More than Moore’s law, the size of materials adopted in advanced manufacturing and electronics packaging, as well as the size of transistors in microelectronics, have become smaller and smaller, which may be significantly influenced by residual stress. Developments in the field of semiconductors have improved human life. After decades of intense searching, the recent demands of carbon neutrality require the fields of semiconductor and industrial manufacturing to meet the standards of carbon reduction and energy saving. Thus, sustainable durability and high reliability issues have become more crucial for the fields of advanced manufacturing and electronic packaging technology. With these trends, the aim of this Special Issue is to report more recent advances regarding residual stress tests, evaluations, and simulations in related fields. Research is also welcome regarding the following related issues: residual stress effects on fracture, fatigue, and failure of materials in semiconductors and manufacturing. These currently open questions, as well as hot and recent topics related to residual stress effects, are all within the scope of this Special Issue. The present Special Issue, “Residual Stress Effects in Advanced Manufacturing and Electronics Packaging”, may become a status report summarizing the progress achieved in the last five years.

Prof. Dr. Fei Qin
Dr. Yanwei Dai
Dr. Si Chen
Guest Editors

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