Special Issue "Plasma Surface Engineering"
Deadline for manuscript submissions: closed (31 December 2020) | Viewed by 11561
Interests: atmospheric-pressure plasma and its applications; low-temperature plasma modeling for semiconductor materials processing; hybrid rocket propulsion, rarefied gas dynamics; parallel scientific computing
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Interests: plasma processing techniques; fabrication and characterization of nano-scale and thin film materials; numerical simulation of plasma processes
Interests: fabrication and characterization of nanometer-size devices; plasma diagnostics; plasma medicine and agriculture; plasma etching and nanoprocess, and nanographene synthesis
We would like to invite you to submit your recent work to this Special Issue on “Plasma Surface Engineering”. Surface engineering plays an important role in all kinds of applications in modern science and engineering. Among these different techniques for surface engineering, plasma surface engineering has been termed as one of the most important and versatile technologies for many years and is still growing rapidly. Its development has been strongly supported by universities, research institutes, and industrial companies around the world.
The objective of this Special Issue is to demonstrate the recent theoretical, experimental, and modeling studies, which would lead to a more wide-spread application of plasma surface engineering through a more thorough understanding of the surface science and technologies that underly it. All kinds of original research and review papers related to this topic from leading groups around the world are welcome.
In particular, the topics of interest include, but are not limited to:
- Principles of plasma–surface interaction;
- Methods of in-situ process diagnostics of plasma treated surface;
- Simulation and modeling of growth, structure, and properties of plasma-interacted surface;
- Analytics of film structures;
- Atmospheric-pressure plasma and its application in biomedicine and biology;
- Plasma-enhanced chemical vapor deposition and applications;
- Physical vapor deposition through discharge processes;
- Plasma etching, pattern transfer and related effects and related applications;
- Plasma cleaning and functionalization;
- Plasma surface treatment effects on adhesion and bonding;
- Protective and tribological coatings using plasma technologies;
- Optical coatings using plasma.
Prof. Jong-Shinn Wu
Prof. Cheng-Che (Jerry) Hsu
Prof. Kenji Ishikawa
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.