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Radiation and Environmental Effects on Electronic Devices: Reliability, Failure, and Protection

This special issue belongs to the section “Electrical, Electronics and Communications Engineering“.

Special Issue Information

Dear Colleagues,

In today’s advanced technological landscape, electronic devices are being deployed in increasingly harsh environments—from outer space to high-altitude aviation, nuclear facilities, the automotive sector, and various industrial zones. Radiation and environmental stressors, such as temperature extremes, humidity, mechanical shock, and ionizing radiation, pose serious threats to device reliability.

Exposure to these factors can cause the degradation of materials, transient faults, or permanent failures in microelectronic circuits. Radiation may induce single-event upsets (SEUs), latch-up, total ionizing dose (TID) effects or displacement damage (DD), potentially compromising mission-critical systems.

To ensure the long-term performance and safety of electronic systems, it is essential to understand the failure mechanisms generated by these stressors, mitigation techniques and protective design strategies, and robust testing standards to validate their reliability under extreme conditions.

This Special Issue seeks manuscripts that address the abovementioned challenges, helping engineers design electronics that withstand even the most unforgiving environments—extending operational life, ensuring functional safety, and preserving data integrity.

Prof. Dr. Cher Ming Tan
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • degradation
  • safety
  • testing
  • mission-critical electronic systems
  • failure analysis
  • mitigation

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Appl. Sci. - ISSN 2076-3417