2026 March - 5 articles
Accurate modeling of RF capacitors and inductors is critical for predicting circuit behavior and ensuring operational robustness in high-frequency electronic systems. However, SPICE models are often unavailable from manufacturers, and there is still...
This work presents a systematic design flow for the fundamental building blocks (namely, the low-noise amplifier and the down-conversion mixer) of an analog receiver for 5G backhauling systems implemented in SiGe BiCMOS technology. The proposed metho...
Fine-pitch redistribution layers (RDLs) are key enabling technologies for fan-out wafer-level packaging (FOWLP)-based interposers used in chiplet and high-bandwidth memory (HBM) integration. In this study, a CAR-based photolithography process optimiz...
The growing dependence on third-party foundries for integrated circuit (IC) fabrication has created major security concerns because of hardware Trojan (HT) insertion risks. Traditional detection methods, including side-channel analysis and golden ref...
We demonstrate the fabrication of air gaps in a PECVD SiN interlayer through lateral recess by employing two consecutive plasma etch steps on an AlN/SiN/Al2O3 stack. This approach enables the preservation of sub-100 nm openings in Al2O3, offering a p...
