Microelectronics, Volume 2, Issue 1

Fine-pitch redistribution layers (RDLs) are key enabling technologies for fan-out wafer-level packaging (FOWLP)-based interposers used in chiplet and high-bandwidth memory (HBM) integration. In this study, a CAR-based photolithography process optimiz...

The growing dependence on third-party foundries for integrated circuit (IC) fabrication has created major security concerns because of hardware Trojan (HT) insertion risks. Traditional detection methods, including side-channel analysis and golden ref...

We demonstrate the fabrication of air gaps in a PECVD SiN interlayer through lateral recess by employing two consecutive plasma etch steps on an AlN/SiN/Al₂O₃ stack. This approach enables the preservation of sub-100 nm openings in Al₂O₃, offering a p...