An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
Kulkarni, R.; Wappler, P.; Soltani, M.; Haybat, M.; Guenther, T.; Groezinger, T.; Zimmermann, A. An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages. J. Manuf. Mater. Process. 2019, 3, 18. https://doi.org/10.3390/jmmp3010018
Kulkarni R, Wappler P, Soltani M, Haybat M, Guenther T, Groezinger T, Zimmermann A. An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages. Journal of Manufacturing and Materials Processing. 2019; 3(1):18. https://doi.org/10.3390/jmmp3010018
Chicago/Turabian StyleKulkarni, Romit; Wappler, Peter; Soltani, Mahdi; Haybat, Mehmet; Guenther, Thomas; Groezinger, Tobias; Zimmermann, André. 2019. "An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages" J. Manuf. Mater. Process. 3, no. 1: 18. https://doi.org/10.3390/jmmp3010018