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Journal: J. Manuf. Mater. Process., 2019
Volume: 3
Number: 18
18
Article: An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
Authors: by Romit Kulkarni, Peter Wappler, Mahdi Soltani, Mehmet Haybat, Thomas Guenther, Tobias Groezinger and André Zimmermann
Link: https://www.mdpi.com/2504-4494/3/1/18

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