Search Results (58)

The global expansion of wind energy increases the need for sustainable recycling strategies for glass fiber-reinforced plastic (GFRP) from end-of-life wind turbine blades (WTB). Mechanical recycling is currently the most economically and ecologically viable technology. This study compares post-industrial (PI) waste from laminate cutoffs and post-consumer (PC) GFRP waste from end-of-life WTBs to investigate the influence of waste origin, pretreatment of shredded GFRP, different particle sizes and various matrix formulations on the tensile modulus and tensile strength of pressed bulk molding compounds produced with virgin epoxy resin. Thermogravimetric analysis showed a fiber content of up to 70 wt.%, but the resin residues on the embedded glass fibers dimmish a sufficient bonding of the new matrix system. Finer GFRP fractions consistently yielded higher tensile modulus and strength, with PI and pretreated PC materials performing best. The findings of this study demonstrate that controlled particle size distribution, impurity removal and optimized resin viscosity are key factors to achieve reliable mechanical performance and enable high-value recycling routes for glass fiber composite waste. Full article

This study evaluated the relevance of using bamboo cellulose (BC) compounded with resin (R) for the manufacture of medical orthoses (BCO). A 22-factorial screening experimental design was used, with two experimental factors and six response variables. Three polymer composites (PC) were prepared: S1 (BC 40%, R 60%), S2 (BC 30%, R 70%), and S3 (BC 20%, R 80%), which were molded under a pressure of 10.5 kg in 25 × 5 cm male-female dies, with an internal space of 2 mm, at 20 °C for 24 h. The mechanical properties evaluated included tensile strength (RTRAC), ball penetration resistance (RPEBOL), puncture resistance (RPUNZ), and their corresponding extensions (ETRAC, EPEBOL, and EPUNZ). Mass, tensile strength, elongation, punching resistance, and penetration were determined in accordance with ISO 3801, ISO 9073-3, EN 388, and ASTM D3787 standards. Statistical analysis was performed using Statgraphics Centurion and Past 4.13 software. The results showed that increasing the resin content and decreasing the bamboo cellulose significantly improved the mechanical performance of the material. The S3 samples (BC 20%, R 80%) had the highest mechanical strength values, with a tensile strength of (1049.34 ± 85.57 N; n = 5), representing an increase of 398.60% over the base formulation. Likewise, increases of 92.25% in puncture resistance (24.12 ± 29.91 N; n = 5) and 196% in ball penetration resistance (323.98 ± 1.39 N; n = 5) were recorded. Tensile elongation showed an increase of 228% (7.55 ± 5.01%; n = 5). In the S2 samples (BC 30%, R 70%), the greatest increase was observed in the puncture elongation, with a value of 16.33 ± 1.25 mm (n = 5), corresponding to an increase of 59.78%. Meanwhile, the S1 samples (BC 40%, R 60%) exhibited the highest ball penetration extension value (34.07 ± 1.61 mm; n = 5), while the S2 and S3 formulations recorded decreases of 2.11% and 2.23%, respectively. Additionally, thickness, weight, and density showed a strong correlation with each other (p > 0.05). Overall, the results indicate that the combination of bamboo cellulose and epoxy resin is a sustainable and effective alternative for the development of medical orthoses, due to the significant improvement in their mechanical properties, which supports their application in orthotic devices based on sustainable biomaterials. Full article

Melamine polyphosphate (MPP) is a widely employed additive-type flame retardant for polyamide 6. Generally, a higher loading of MPP leads to improved flame retardancy of polyamide 6 composites. Nevertheless, excessive addition tends to cause problems such as flame-retardant migration, leakage, and exudation. Against this background, this work focuses on covalently grafting melamine polyphosphate onto the surface of carbon nanotubes via a facile chemical reaction, with the aim of alleviating the migration and leakage of the flame retardant in the polyamide 6 matrix. Carbon nanotubes (CNTs) were surface modified with a silane coupling agent (KH560) to obtain CNTs bearing epoxy groups (CNT-KH560). Subsequently, a ring-opening addition reaction was conducted between the CNT-KH560 and melamine polyphosphate (MPP) yielding carbon nanotubes with surface-bonded flame-retardant MPP (CNTM). Polyamide 6 composite slices (PA6/CNTM) were prepared via twin-screw extrusion blending and compounding and then by hot-press molding into test specimens. The modified carbon nanotubes were characterized using Fourier transform infrared spectroscopy, scanning electron microscopy, and thermogravimetric analysis. The results confirmed the successful grafting of MPP onto the carbon nanotube surface, with a grafting degree of 9.1 g/100 g measured. The flame retardancy of the PA6/CNTM composites were evaluated through UL 94 vertical burning and limiting oxygen index (LOI) tests and cone calorimeter. These flame retardancy results indicated that when the content of flame-retardant-modified carbon nanotubes was 10 wt%, the PA6/CNTM10 composites achieved UL 94 V-2 and the limiting oxygen index increased from 24.5% of pure PA6 to 29.1%. The PHRR value of pure PA6 decreased from 750 kW/m² to 614 kW/m². This design of surface-grafted flame retardant provides a new strategy for the preparation and application of high-performance polyamide 6 flame-retardant composites. Full article

Inorganic gap filling technology is an effective method to improve reliability and heterogeneous integration density in 2.5D and 3D integration. It uses plasma-enhanced chemical vapor deposition (PECVD) to deposit silicon dioxide (SiO₂) filler layers in gaps between chiplets. This technology is used to replace the Epoxy Mold Compound (EMC) commonly used in traditional packaging. However, as an inorganic filling material, SiO₂ poses reliability challenges such as cracking and peeling during or after deposition. Furthermore, there lacks quantitative characterization and modeling of the microscale mechanical properties, thermal stress distribution, and fracture failure risk in the filler layer. By combining nanoindentation technology with three-point bending tests, this study reports a comprehensive characterization route for quantitative characterization of mechanical behavior of the filler. A finite element method (FEM) model was also established to predict the thermomechanical reliability of the gap filling process. Raman spectroscopy measured data confirm the model’s reliable predictive ability. The results reveal the impact of filler thickness on the stress. The microscale SiO₂ mechanical characterization method and the thermal stress and fracture risk FEM prediction model in this study not only address the limitations of traditional testing and simulation but also provide support for process optimization and structural design of gap filling in high-density 2.5D/3D packaging. This work promotes the understanding of inorganic filling process reliability in chiplet integration. Full article

In this study, the reliability differences between a normal structure and a six-sided protective structure are investigated for 300 mm fan-out wafer-level packaging. Theoretical analysis indicates that the six-sided protective structure exhibits lower thermal stress (dropping by 9.06%) and superior thermal stability. The introduced epoxy molding compound (EMC) protective layer bonds tightly with other layers without changing the performance of the solder balls, such as shear strength and failure modes. After reliability testing, all the normal structure samples passed the high accelerated stress test (HAST) and temperature cycling testing (TCT), but none passed the pressure cooking testing (PCT). By contrast, the six-sided protective structure samples passed all tests. Scanning acoustic microscopy and cross-sectional scanning electron microscopy (SEM) pictures further confirmed that the six-sided protective structure passed the PCT. This result indicates that the reliability of the six-sided protective structure has been strengthened, consistent with the simulation analysis. A packaging solution for enhancing reliability by reducing structural thermal stress has been suggested. Full article

This paper investigates the suppression of the cohesive cracking mode (CCM) in the sintered silver (s-Ag) die layer by intentionally introducing anisotropic porosity through two press sintering methods. Full press (FP) and local press (LP) bonding represent the s-Ag formed by pressing the die-attached assemblies (DAAs) on either the entire top surface or only on the silicon carbide (SiC) top surface, respectively. The fabricated DAAs were encapsulated with epoxy molding compounds. Degradation was evaluated using a nine-point bending test (NBT) under cyclic force between 0 and 270 N with a triangle waveform for 3 min per cycle at 150 °C. Scanning tomography images after 500 NBT cycles showed that the LP reduced the inner degradation ratio by up to 21.1% compared to the FP. Cross-sectional scanning electron microscopy revealed that the FP progressed cracking in the s-Ag die layer, whereas the LP showed no evidence of cracking. A finite element analysis revealed that in the FP, the accumulated plastic strain (APS) was concentrated in the s-Ag layer within the inner SiC chip. In contrast, the APS of the LP was preferentially concentrated outside the SiC chip. This preferential localization of damage outside the chip presents a promising approach for enhancing the reliability of packaging products. Full article

With the increasing complexity and integration density of System-in-Package (SiP) technologies, the demand for selective electromagnetic interference (EMI) shielding is growing. Conventional sputtering processes, while effective for conformal EMI shielding, lack selectivity and often require additional masking or post-processing steps. In this study, we propose a novel, laser-based approach for the selective removal of EMI shielding layers without physical masking. Numerical simulations were conducted to investigate the thermal and mechanical behavior of multilayer EMI shielding structures under two irradiation modes: full-area and laser scanning. The results showed that the laser scanning method induced higher interfacial shear stress, reaching up to 38.6 MPa, compared to full-area irradiation (12.5 MPa), effectively promoting delamination while maintaining the integrity of the underlying epoxy mold compound (EMC). Experimental validation using a nanosecond pulsed fiber laser confirmed that complete removal of the EMI shielding layer could be achieved at optimized laser powers (~6 W) without damaging the EMC, whereas excessive power (8 W) caused material degradation. The laser scanning speed was 50 mm/s, and the total laser irradiation time of the package was 0.14 s, which was very fast. This study demonstrates the feasibility of a non-contact, damage-free, and selective EMI shielding removal technique, offering a promising solution for next-generation semiconductor packaging. Full article

As semiconductor devices demand higher input–output density and faster signal transmission, fan-out panel-level packaging has emerged as a promising solution for next-generation electronic systems. However, the hygroscopic nature of epoxy molding compounds raises critical reliability concerns under high-temperature and high-humidity conditions. This study investigates the hygrothermal stress of a single fan-out panel-level package unit through experimental characterization and numerical simulation. Thermal–mechanical analysis was conducted at 100 °C and 260 °C to evaluate the strain behavior of two commercial epoxy molding compounds in granule form after moisture saturation. The coefficient of moisture expansion was calculated by correlating strain variation with moisture uptake obtained under 85 °C and 85% relative humidity, corresponding to moisture sensitivity level 1 conditions. These values were directly considered into a moisture -thermal coupled finite element analysis. The simulation results under reflow conditions demonstrate accurate principal stress and failure location predictions, with stress concentrations primarily observed at the die corners. The results confirm that thermal effects influence stress development more than moisture effects. Finally, a structural sensitivity analysis of the single-package configuration showed that optimizing the thickness of the dies and epoxy molding compound can reduce maximum principal stress by up to 12.4%, providing design insights for improving package-level reliability. Full article

As one of the most widely used packaging materials, epoxy composite (EP) offers excellent insulation properties; however, its intrinsic low thermal conductivity (TC) limits its application in high-frequency and high-power devices. To enhance the TC of EP, six highly thermally conductive inorganic fillers, namely, Al₂O₃, MgO, ZnO, Si₃N₄, h-BN, and AlN, were incorporated into the EP matrix at varying contents (60–90 wt.%). The resulting epoxy molding compounds (EMCs) demonstrated significant improvement in thermal conductivity coefficient (λ) at high filler contents (90 wt.%), ranging from 0.67 W m⁻¹ K⁻¹ to 1.19 W m⁻¹ K⁻¹, compared to the pristine epoxy composite preform (ECP, 0.36 W m⁻¹ K⁻¹). However, it was found that the interfacial thermal resistance (ITR) between EP and filler materials is a major hindrance restricting TC improvement. In order to address this challenge, graphene nanosheets (GNSs) and carbon nanotubes (CNTs) were introduced as additives to reduce the ITR. The experimental results indicated that CNTs were effective in enhancing the TC, with the optimized EMC achieving a λ value of 1.14 W m⁻¹ K⁻¹ using 60 wt.% Si₃N₄ + 2 wt.% CNTs. Through the introduction of a small amount of CNT (2 wt.%), the inorganic filler content was significantly reduced from 90 wt.% to 60 wt.% while still maintaining high thermal conductivity (1.14 W m⁻¹ K⁻¹). We propose that the addition of CNTs helps in the construction of a partial heat conduction network within the EP matrix, thereby facilitating interfacial heat transfer. Full article

As the demand for smaller and more multifunctional integrated circuit (IC) products increases, system-in-package (SiP) has emerged as a key trend in IC encapsulation. However, the use of polymer-based materials such as epoxy molding compounds (EMCs) introduces complex flow behaviors during the encapsulation process, often leading to void formation, especially in highly integrated SiP structures. This study employs the Moldex3D 2024 R3 simulation software to perform mold-filling analyses of SiP packages using EMC as the encapsulant. The objective is to investigate why voids are consistently observed in the leftmost column of the strip and to determine how to reduce the void size using the Taguchi optimization method. To replicate the actual vacuum-assisted molding conditions, a 1/5 strip model with venting was established. Results show that the flow dynamics of the polymeric encapsulant are significantly affected by shielding frame geometry. Among various design modifications, adding an additional column of shielding metal frame on the left side of the strip most effectively reduces void formation. This research highlights the importance of polymer flow behavior in void prediction and optimization for advanced SiP packaging, providing practical guidelines for material-driven design improvements in IC encapsulation processes. Full article

Dynamic mechanical analysis (DMA) is routinely practiced in the semiconductor industry to measure the viscoelastic properties of various thermosetting polymers. Modern commercial DMA test machines are highly-advanced systems which enable users to perform automatic testing and post-processing of the experimental data. When highly filled thermosets like epoxy-based molding compound (EMC) are tested, unique challenges are encountered during measurements due to the extremely large change in modulus over the testing temperature range. An advanced procedure is proposed to cope with these problems. The first part is the use of different oscillation strain amplitudes so that the variations in stress amplitudes across the testing domain remain consistent. The second part is the conducting of two monotonic tests at the lowest and highest temperatures to obtain the glassy modulus and equilibrium modulus, which can guide the master curve construction accurately. The results of the proposed procedure are presented. The relaxation modulus master curve is used to conduct a virtual testing to verify the accuracy of the generalized Maxwell model constants determined from the frequency data using the proposed procedure. Full article

The rapid advancement of artificial intelligence (AI) technologies has significantly increased the demand for high-performance computational hardware. Memristor-based compute-in-memory (CIM) technology, also known as resistive random-access memory (RRAM)-based CIM technology, shows great potential for addressing the data transfer bottleneck and supporting high-performance computing (HPC). In this paper, a multi-scale thermal model is developed to evaluate the temperature distribution in RRAM-based CIM chips and the influence of various factors on thermal behavior. The results indicate that hotspot temperatures can be mitigated by reducing the epoxy molding compound (EMC) thickness, increasing the substrate thickness, and lowering boundary thermal resistance. Moreover, optimizing the layout of analog computing circuits and digital circuits can reduce the maximum temperature by up to 4.04 °C. Furthermore, the impact of temperature on the conductance of RRAM devices and the inference accuracy of RRAM-based CIM chips is analyzed. Simulation results reveal that thermal-induced accuracy loss in CIM chips is significant, but the computation correction method effectively reduces the accuracy loss from 66.4% to 1.4% at 85 °C. Full article

As the trend towards the densification of integrated circuit (IC) devices continues, the complexity of interfaces involving dissimilar materials and thermo-mechanical interactions has increased. Highly integrated systems in packages now comprise numerous thin layers made from various materials. The interfaces between these different materials represent a vulnerable point in ICs due to imperfect adhesion and stress concentrations caused by mismatches in thermo-mechanical properties such as Young’s modulus, coefficients of thermal expansion (CTE), and hygro-swelling-induced expansion. This study investigates the impact of thermal variations on the fracture behavior of three bi-material interfaces used in semiconductor packaging: epoxy molding compound–silicon (EMC–Si), silicon oxide–polyimide (SiO₂–PI), and PI–EMC. Using double cantilever beam (DCB) tests, we analyzed these interfaces under mode I loading at three temperatures: −20 °C, 23 °C, and 100 °C, under both quasi-static and cyclic loading conditions. This provided a comprehensive analysis of the thermal effects across all temperature ranges in microelectronics. The results show that temperature significantly alters the failure mechanism. For SiO₂–PI, the weakest point shifts from silicon at low temperatures to the interface at higher temperatures due to thermal stress redistribution. Additionally, the fracture energy of the EMC–Si interface was found to be highly temperature-dependent, with values ranging from 0.136 N/mm at low temperatures to 0.38 N/mm at high temperatures. SiO₂–PI’s fracture energy at high temperature was 42% less than that of EMC–Si. The PI–EMC interface exhibited nearly double the crack growth rate compared to EMC–Si. The findings of this study provide valuable insights into the fracture behavior of bi-material interfaces, offering practical applications for improving the reliability and design of semiconductor devices, especially in chip packaging. Full article

The problems created by conventional polymers after their end use have driven research into new biodegradable polymeric materials. PLA is a compostable polymer obtained from renewable sources, but its main drawbacks are its fragility and slow crystallization kinetics. These drawbacks limit its use in different applications. In order to overcome fragility, in the current study, different compositions of PLA/PCL blends, rich in PLA content and without and with DGEBA, were prepared and characterized by means of different techniques, such as FTIR, DSC, DMA, and the mechanical properties. Some compositions show a certain improvement in the deformation capacity compared to the neat PLA at a low test speed. However, when the test speed increases, no improvement is observed in terms of deformation capacity. By SEM, the morphology of injection-molded specimens was observed. All blends showed a biphasic morphology where the PCL droplets are dispersed within the continuous PLA matrix. In the current study, an attempt has been made to improve the compatibility and adhesion between the phases by incorporating a diglycidyl bisphenol A compound. The results obtained indicate that the epoxy groups seem to react with the end groups of the PLA chain; however, the interactions that it creates with the PCL phase are weak, which is in agreement with the FTIR and DSC results obtained. Full article

With the development of high-density integrated chips, low-k dielectric materials are used in the back end of line (BEOL) to reduce signal delay. However, due to the application of fine-pitch packages with high-hardness copper pillars, BEOL is susceptible to chip package interaction (CPI), which leads to reliability issues such as the delamination of interlayer dielectric (ILD) layers. In order to improve package reliability, the effect of CPI at multi-scale needs to be explored in terms of package integration. In this paper, the stress of BEOL in the flip-chip chip-scale packaging (FCCSP) model during thermal cycling is investigated by using the finite-element-based sub-model approach. A three-dimensional (3D) multi-level finite element model is established based on the FCCSP. The wiring layers were treated by the equivalent homogenization method to ensure high prediction accuracy. The stress distribution of the BEOL around the critical bump was analyzed. The cracking risk of the interface layer of the BEOL was assessed by pre-cracking at a dangerous location. In addition, the effects of the epoxy molding compound (EMC) thickness, polyimide (PI) opening, and coefficient of thermal expansion (CTE) of the underfill on cracking were investigated. The simulation results show that the first principal stress of BEOL is higher at high-temperature moments than at low-temperature moments, and mainly concentrated near the PI opening. Compared with the oxide layer, the low-k layer has a higher risk of cracking. A smaller EMC thickness, lower CTE of the underfill, and larger PI opening help to reduce the risk of cracking in the BEOL. Full article