Mohamed, A.T.I.; Schimperna, G.; Cantoni, G.; Demichelis, F.; Fino, D.; Perucchini, S.; Rubertelli, F.; Laviano, F.
Effect of Solvent Pre-Treatment on the Leaching of Copper During Printed Circuit Board Recycling. Recycling 2025, 10, 80.
https://doi.org/10.3390/recycling10030080
AMA Style
Mohamed ATI, Schimperna G, Cantoni G, Demichelis F, Fino D, Perucchini S, Rubertelli F, Laviano F.
Effect of Solvent Pre-Treatment on the Leaching of Copper During Printed Circuit Board Recycling. Recycling. 2025; 10(3):80.
https://doi.org/10.3390/recycling10030080
Chicago/Turabian Style
Mohamed, Ahmed Tarek Ismail, Giuliana Schimperna, Gianluca Cantoni, Francesca Demichelis, Debora Fino, Sara Perucchini, Francesca Rubertelli, and Francesco Laviano.
2025. "Effect of Solvent Pre-Treatment on the Leaching of Copper During Printed Circuit Board Recycling" Recycling 10, no. 3: 80.
https://doi.org/10.3390/recycling10030080
APA Style
Mohamed, A. T. I., Schimperna, G., Cantoni, G., Demichelis, F., Fino, D., Perucchini, S., Rubertelli, F., & Laviano, F.
(2025). Effect of Solvent Pre-Treatment on the Leaching of Copper During Printed Circuit Board Recycling. Recycling, 10(3), 80.
https://doi.org/10.3390/recycling10030080