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Journal: Processes, 2024
Volume: 12
Number: 2029

Article: Multiphysics to Investigate the Thermal and Mechanical Responses in Hard Disk Drive Components Due to the Reflow Soldering Process
Authors: by Napatsorn Kimaporn, Chawit Samakkarn and Jatuporn Thongsri
Link: https://www.mdpi.com/2227-9717/12/9/2029

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