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Journal: Processes, 2024
Volume: 12
Number: 2029
Article:
Multiphysics to Investigate the Thermal and Mechanical Responses in Hard Disk Drive Components Due to the Reflow Soldering Process
Authors:
by
Napatsorn Kimaporn, Chawit Samakkarn and Jatuporn Thongsri
Link:
https://www.mdpi.com/2227-9717/12/9/2029
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