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Journal: Electronics, 2025
Volume: 14
Number: 3438
3438
Article: FirmVulLinker: Leveraging Multi-Dimensional Firmware Profiling for Identifying Homologous Vulnerabilities in Internet of Things Devices
Authors: by Yixuan Cheng, Fengzhi Xu, Lei Xu, Yang Ge, Jingyu Yang, Wenqing Fan, Wei Huang and Wen Liu
Link: https://www.mdpi.com/2079-9292/14/17/3438

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