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Journal: CoatingsVolume: 8Number: 401
Article: A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers
- Authors:
- Cherng-Yuh Su1,2,3,*,
- Jia-Liang Huang2 and
- Po-Chun Chen4
- et al.
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