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Journal: Coatings, 2023
Volume: 13
Number: 748

Article: Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices
Authors: by Wenyu Wu, Geng Li, Shang Wang, Yiping Wang, Jiayun Feng, Xiaowei Sun and Yanhong Tian
Link: https://www.mdpi.com/2079-6412/13/4/748

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