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Journal: Appl. Sci., 2019
Volume: 9
Number: 4613

Article: Experimental Investigation of Thin PCM Packages and Thermal Spreader for Thermal Management of Portable Electronic Devices
Authors: by Simon Maranda, Benjamin Sponagle, Jörg Worlitschek and Dominic Groulx
Link: https://www.mdpi.com/2076-3417/9/21/4613

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