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Journal: Appl. Sci., 2021
Volume: 11
Number: 10763

Article: Development of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method
Authors: by Dong-Woo Seo, Kyu-San Jung, Yi-Seul Kim, Hyung-Jin Kim and Wongi S. Na
Link: https://www.mdpi.com/2076-3417/11/22/10763

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