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Journal: Appl. Sci., 2020
Volume: 10
Number: 47

Article: Effect of Different Bonding Materials on Flip-Chip LED Filament Properties
Authors: by Chengyu Guan, Jun Zou, Qingchang Chen, Mingming Shi and Bobo Yang
Link: https://www.mdpi.com/2076-3417/10/1/47

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