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Journal: Polymers, 2021
Volume: 13
Number: 3337
Article:
Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review
Authors:
by
Md. Abdul Alim, Mohd Zulkifly Abdullah, Mohd Sharizal Abdul Aziz, R. Kamarudin and Prem Gunnasegaran
Link:
https://www.mdpi.com/2073-4360/13/19/3337
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