Zhang, S.-C.; Li, S.-S.; Ji, Y.; Yang, N.; Shan, Y.-H.; Hong, L.; Wang, H.-G.; Zhao, W.-S.; Wang, D.-W.
SPICE-Compatible Degradation Modeling Framework for TDDB and LER Effects in Advanced Packaging BEOL Based on Ion Migration Mechanism. Micromachines 2025, 16, 766.
https://doi.org/10.3390/mi16070766
AMA Style
Zhang S-C, Li S-S, Ji Y, Yang N, Shan Y-H, Hong L, Wang H-G, Zhao W-S, Wang D-W.
SPICE-Compatible Degradation Modeling Framework for TDDB and LER Effects in Advanced Packaging BEOL Based on Ion Migration Mechanism. Micromachines. 2025; 16(7):766.
https://doi.org/10.3390/mi16070766
Chicago/Turabian Style
Zhang, Shao-Chun, Sen-Sen Li, Ying Ji, Ning Yang, Yuan-Hao Shan, Li Hong, Hao-Gang Wang, Wen-Sheng Zhao, and Da-Wei Wang.
2025. "SPICE-Compatible Degradation Modeling Framework for TDDB and LER Effects in Advanced Packaging BEOL Based on Ion Migration Mechanism" Micromachines 16, no. 7: 766.
https://doi.org/10.3390/mi16070766
APA Style
Zhang, S.-C., Li, S.-S., Ji, Y., Yang, N., Shan, Y.-H., Hong, L., Wang, H.-G., Zhao, W.-S., & Wang, D.-W.
(2025). SPICE-Compatible Degradation Modeling Framework for TDDB and LER Effects in Advanced Packaging BEOL Based on Ion Migration Mechanism. Micromachines, 16(7), 766.
https://doi.org/10.3390/mi16070766
