- Communication
Ultrathin Small Outline Package Key Techniques for High-Speed Chips with Multi-Leads
- Lijun Zhang,
- Wenqiang Dang,
- Yongshun Wang and
- Jinbing Zhang
The key technologies for the ultrathin small outline package (TSOP) of large-sized high-speed chips have been designed and developed in this paper. The designing techniques, such as a 25 µm precise positioning dice attaching technique, a lead f...

