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Journal: Micromachines, 2024
Volume: 15
Number: 1177

Article: Variation of MEMS Thin Film Device Parameters under the Influence of Thermal Stresses
Authors: by Xiao Wen, Jinchuan Chen, Ruiwen Liu, Chunhua He, Qinwen Huang and Huihui Guo
Link: https://www.mdpi.com/2072-666X/15/10/1177

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