- Article
Investigation of Integrated Reactive Multilayer Systems for Bonding in Microsystem Technology
- El-Mostafa Bourim,
- Il-Suk Kang and
- Hee Yeoun Kim
For the integration of a reactive multilayer system (iRMS) with a high exothermic reaction enthalpy as a heat source on silicon wafers for low-temperature bonding in the 3D integration and packaging of microsystems, two main conflicting issues should...

