Wang, Z.; Chen, J.; Zong, Y.; Xing, S.; Wu, J.; Huang, Y.; Wu, X.; Xu, Z.; He, X.; Wang, X.;
et al. Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio. Materials 2025, 18, 960.
https://doi.org/10.3390/ma18050960
AMA Style
Wang Z, Chen J, Zong Y, Xing S, Wu J, Huang Y, Wu X, Xu Z, He X, Wang X,
et al. Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio. Materials. 2025; 18(5):960.
https://doi.org/10.3390/ma18050960
Chicago/Turabian Style
Wang, Zheng, Jinfang Chen, Yue Zong, Shuai Xing, Jiani Wu, Yawei Huang, Xiaowei Wu, Zhejia Xu, Xuhao He, Xiaohu Wang,
and et al. 2025. "Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio" Materials 18, no. 5: 960.
https://doi.org/10.3390/ma18050960
APA Style
Wang, Z., Chen, J., Zong, Y., Xing, S., Wu, J., Huang, Y., Wu, X., Xu, Z., He, X., Wang, X., Huang, X., Chen, Z., Liu, X., & Wang, D.
(2025). Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio. Materials, 18(5), 960.
https://doi.org/10.3390/ma18050960
