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Journal: Materials, 2024
Volume: 17
Number: 4966

Article: Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications
Authors: by Arjun Wadhwa, Mohammad Saadati, Jaime Benavides-Guerrero, Martin Bolduc and Sylvain G. Cloutier
Link: https://www.mdpi.com/1996-1944/17/20/4966

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