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Journal: Materials, 2023
Volume: 16
Number: 7275
7275
Article: Influence of HCl Concentration on Corrosion Behavior between Au or Cu Bonding Wires and the Bond Pad for Semiconductor Packaging
Authors: by Young-Ran Yoo, Gyubinn Kim, Sung-Min Jeon, Hyun-Jun Park, Won-Wook Seo, Jeong-Tak Moon and Young-Sik Kim
Link: https://www.mdpi.com/1996-1944/16/23/7275

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