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Journal: Materials, 2023
Volume: 16
Number: 6504

Article: A Nickel Dissolution Process for Multilayer Electroforming to Achieve Ultrahigh Adhesion Strength
Authors: by Zhuangzhuang Wang, Chunjian Shen, Zhou Ma, Zengwei Zhu and Di Zhu
Link: https://www.mdpi.com/1996-1944/16/19/6504

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