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Baek N, Park Y, Lim H, Cha J, Jang T, Kang S, Jang S, Jung D. Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF₄/O₂ Plasma for Semiconductor Multilevel Interconnects. Materials. 2023; 16(13):4663. https://doi.org/10.3390/ma16134663

Baek, Namwuk, Yoonsoo Park, Hyuna Lim, Jihwan Cha, Taesoon Jang, Shinwon Kang, Seonhee Jang, and Donggeun Jung. 2023. "Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF₄/O₂ Plasma for Semiconductor Multilevel Interconnects" Materials 16, no. 13: 4663. https://doi.org/10.3390/ma16134663

Baek, N., Park, Y., Lim, H., Cha, J., Jang, T., Kang, S., Jang, S., & Jung, D. (2023). Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF₄/O₂ Plasma for Semiconductor Multilevel Interconnects. Materials, 16(13), 4663. https://doi.org/10.3390/ma16134663