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Journal: MaterialsVolume: 15Number: 8419
Article: Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes
- Authors:
- Hyeokgi Choi1,†,
- Chang-Lae Kim2,† and
- Yoonchul Sohn1,*
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